Authors: JU YS KURABAYASHI K GOODSON KE

Citation: Ys. Ju et al., THERMAL CHARACTERIZATION OF IC PASSIVATION LAYERS USING JOULE HEATINGAND OPTICAL THERMOMETRY, Microscale thermophysical engineering, 2(2), 1998, pp. 101-110

Authors: CHUI BW STOWE TD JU YS GOODSON KE KENNY TW MAMIN HJ TERRIS BD RIED RP RUGAR D

Citation: Bw. Chui et al., LOW-STIFFNESS SILICON CANTILEVERS WITH INTEGRATED HEATERS AND PIEZORESISTIVE SENSORS FOR HIGH-DENSITY AFM THERMOMECHANICAL DATA-STORAGE, Journal of microelectromechanical systems, 7(1), 1998, pp. 69-78

Authors: JU YS GOODSON KE

Citation: Ys. Ju et Ke. Goodson, SHORT-TIME-SCALE THERMAL MAPPING OF MICRODEVICES USING A SCANNING THERMOREFLECTANCE TECHNIQUE, Journal of heat transfer, 120(2), 1998, pp. 306-313

Authors: JU YS GOODSON KE

Citation: Ys. Ju et Ke. Goodson, SIZE EFFECT ON THERMAL CONDUCTION IN SILICON-ON-INSULATOR DEVICES UNDER ELECTROSTATIC DISCHARGE (ESD) CONDITIONS, JPN J A P 2, 36(6B), 1997, pp. 798-800

Authors: JU YS KADING OW LEUNG YK WONG SS GOODSON KE

Citation: Ys. Ju et al., SHORT-TIMESCALE THERMAL MAPPING OF SEMICONDUCTOR-DEVICES, IEEE electron device letters, 18(5), 1997, pp. 169-171

Authors: JU YS GOODSON KE

Citation: Ys. Ju et Ke. Goodson, THERMAL MAPPING OF INTERCONNECTS SUBJECTED TO BRIEF ELECTRICAL STRESSES, IEEE electron device letters, 18(11), 1997, pp. 512-514