Authors: KUHN SA KLEINER MB WERNER W

Citation: Sa. Kuhn et al., MULTIPARALLEL SYSTOLIC ARRAYS FOR MULTIDIMENSIONAL FFT-ARCHITECTURES ON 3D-VLSI, Journal of systems architecture, 43(1-5), 1997, pp. 7-14

Authors: KLEINER MB KUHN SA RAMM P WEBER W

Citation: Mb. Kleiner et al., PERFORMANCE IMPROVEMENT OF THE MEMORY-HIERARCHY OF RISC-SYSTEMS BY APPLICATION OF 3-D TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(4), 1996, pp. 709-718

Authors: KUHN SA KLEINER MB RAMM P WEBER W

Citation: Sa. Kuhn et al., PERFORMANCE MODELING OF THE INTERCONNECT STRUCTURE OF A 3-DIMENSIONALINTEGRATED RISC PROCESSOR CACHE SYSTEM/, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(4), 1996, pp. 719-727

Authors: KLEINER MB KUHN SA WEBER W

Citation: Mb. Kleiner et al., THERMAL-CONDUCTIVITY MEASUREMENTS OF THIN SILICON DIOXIDE FILMS IN INTEGRATED-CIRCUITS, I.E.E.E. transactions on electron devices, 43(9), 1996, pp. 1602-1609

Authors: KLEINER MB KUHN SA HABERGER K

Citation: Mb. Kleiner et al., HIGH-PERFORMANCE FORCED-AIR COOLING SCHEME EMPLOYING MICROCHANNEL HEAT-EXCHANGERS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 795-804