Authors: Kopperschmidt, P Kimerling, LC

Citation: P. Kopperschmidt et Lc. Kimerling, Model of a two-dimensional photonic bicrystal - art. no. 045101, PHYS REV B, 6304(4), 2001, pp. 5101

Authors: Gosele, U Tong, QY Schumacher, A Krauter, G Reiche, M Plossl, A Kopperschmidt, P Lee, TH Kim, WJ

Citation: U. Gosele et al., Wafer bonding for microsystems technologies, SENS ACTU-A, 74(1-3), 1999, pp. 161-168

Authors: Gosele, U Bluhm, Y Kastner, G Kopperschmidt, P Krauter, G Scholz, R Schumacher, A Senz, S Tong, QY Huang, LJ Chao, YL Lee, TH

Citation: U. Gosele et al., Fundamental issues in wafer bonding, J VAC SCI A, 17(4), 1999, pp. 1145-1152

Authors: Kopperschmidt, P Senz, S Scholz, R Gosele, U

Citation: P. Kopperschmidt et al., "Compliant" twist-bonded GaAs substrates: The potential role of pinholes, APPL PHYS L, 74(3), 1999, pp. 374-376

Authors: Heinrich, F Heinze, D Kowalski, T Hoffmann, P Kopperschmidt, P

Citation: F. Heinrich et al., Multichannel process monitor for real-time film thickness and rate measurements in dry etching and deposition, VACUUM, 51(4), 1998, pp. 497-502