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Results: 4

Authors: LOUIS D LAJOINIE E LEE WM HOLMES D
Citation: D. Louis et al., A POST METAL ETCH CLEANING PROCESS FOR 0.25 MU-M TECHNOLOGY, Microelectronic engineering, 42, 1998, pp. 377-381

Authors: LOUIS D LAJOINIE E PIRES F LEE WM HOLMES D
Citation: D. Louis et al., POST ETCH CLEANING OF LOW-K DIELECTRIC MATERIALS FOR ADVANCED INTERCONNECTS - CHARACTERIZATION AND PROCESS OPTIMIZATION, Microelectronic engineering, 42, 1998, pp. 415-418

Authors: CZUPRYNSKI P JOUBERT O HEITZMANN M LOUIS D VIZIOZ C LAJOINIE E
Citation: P. Czuprynski et al., EFFICIENCY EVALUATION OF POSTETCH METAL STACK ANTICORROSION TREATMENTS USING CHEMICAL-ANALYSES BY X-RAY PHOTOELECTRON-SPECTROSCOPY AND WIDEDISPERSIVE-X-RAY FLUORESCENCE, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 15(4), 1997, pp. 1000-1007

Authors: PIRES F NOEL P LECORNEC C PASSEMARD G LOUIS D LAJOINIE E
Citation: F. Pires et al., INTEGRATION EVALUATION OF LOW PERMITTIVITY SILICON-BASED SPIN ON MATERIALS AS IMD, Microelectronic engineering, 37-8(1-4), 1997, pp. 277-284
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