AAAAAA
Results: 1-25/59
Authors:
LIN KL
CHAO WH
Citation: Kl. Lin et Wh. Chao, MATERIAL INTERACTIONS OF SOLDER BUMPS PRODUCED WITH FLUXLESS WAVE SOLDERING, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 59-64
Authors:
HUANG SP
LIN KL
FANG LS
Citation: Sp. Huang et al., THE INVOLVEMENT OF CALCIUM IN HEAT-INDUCED CORAL BLEACHING, Zoological studies, 37(2), 1998, pp. 89-94
Authors:
LIN KL
WEN LH
Citation: Kl. Lin et Lh. Wen, THE WETTING OF COPPER BY AL ZN SN SOLDERS, Journal of materials science. Materials in electronics, 9(1), 1998, pp. 5-8
Authors:
LIN KL
WEN LH
LIU TP
Citation: Kl. Lin et al., THE MICROSTRUCTURES OF THE SN-ZN-AL SOLDER ALLOYS, Journal of electronic materials, 27(3), 1998, pp. 97-105
Authors:
LIN KL
WANG YC
Citation: Kl. Lin et Yc. Wang, WETTING INTERACTION OF PB-FREE SN-ZN-AL SOLDERS ON METAL PLATED SUBSTRATE, Journal of electronic materials, 27(11), 1998, pp. 1205-1210
Authors:
LIN KL
LIU TP
Citation: Kl. Lin et Tp. Liu, THE ELECTROCHEMICAL CORROSION BEHAVIOR OF PB-FREE AL-ZN-SN SOLDERS INNACL SOLUTION, Materials chemistry and physics, 56(2), 1998, pp. 171-176
Authors:
LIN KL
CHUNG FC
LIU TP
Citation: Kl. Lin et al., THE POTENTIODYNAMIC POLARIZATION BEHAVIOR OF PB-FREE XIN-9(5AL-ZN)-YSN SOLDERS, Materials chemistry and physics, 53(1), 1998, pp. 55-59
Authors:
LIN KL
LIU TP
Citation: Kl. Lin et Tp. Liu, HIGH-TEMPERATURE OXIDATION OF A SN-ZN-AL SOLDER, Oxidation of metals, 50(3-4), 1998, pp. 255-267
Authors:
LIN YC
LAI WK
LIN KL
Citation: Yc. Lin et al., A NUMERICAL APPROACH TO DETERMINING THE TRANSIENT-RESPONSE OF NONRECTANGULAR BARS SUBJECTED TO TRANSVERSE ELASTIC IMPACT, The Journal of the Acoustical Society of America, 103(3), 1998, pp. 1468-1474
Authors:
ARRUDA LK
VAILES LD
PLATTSMILLS TAE
FERNANDEZCALDAS E
MONTEALEGRE F
LIN KL
CHUA KY
RIZZO MC
NASPITZ CK
CHAPMAN MD
Citation: Lk. Arruda et al., SENSITIZATION TO BLOMIA-TROPICALIS IN PATIENTS WITH ASTHMA AND IDENTIFICATION OF ALLERGEN BLO-T-5, American journal of respiratory and critical care medicine, 155(1), 1997, pp. 343-350
Authors:
CHEN CJ
LIN KL
Citation: Cj. Chen et Kl. Lin, WETTING INTERACTIONS BETWEEN THE NI-CU-P DEPOSIT AND IN-SN SOLDERS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(3), 1997, pp. 211-216
Authors:
LYNCH NR
THOMAS WR
GARCIA NM
DIPRISCO MC
PUCCIO FA
LOPEZ RI
HAZELL LA
SHEN HD
LIN KL
CHUA KY
Citation: Nr. Lynch et al., BIOLOGICAL-ACTIVITY OF RECOMBINANT DER-P-2, DER-P-5 AND DER-P-7 ALLERGENS OF THE HOUSE-DUST MITE DERMATOPHAGOIDES-PTERONYSSINUS, International archives of allergy and immunology, 114(1), 1997, pp. 59-67
Authors:
LEE CY
LIN KL
Citation: Cy. Lee et Kl. Lin, PREPARATION OF SOLDER BUMPS INCORPORATING ELECTROLESS NICKEL-BORON DEPOSIT AND INVESTIGATION ON THE INTERFACIAL INTERACTION BEHAVIOR AND WETTING KINETICS, Journal of materials science. Materials in electronics, 8(6), 1997, pp. 377-383
Authors:
LIN KL
CHEN SK
CHANG SY
Citation: Kl. Lin et al., ADHESION OF MULTILAYER SOLDER PADS ON SILICON, Journal of materials science. Materials in electronics, 8(4), 1997, pp. 253-257
Authors:
CUBIOTTI P
LIN KL
YAO JC
Citation: P. Cubiotti et al., GENERALIZED QUASI-VARIATIONAL INEQUALITIES FOR FUZZY MAPPINGS, Computers & mathematics with applications, 33(7), 1997, pp. 121-134
Authors:
LIN KL
WANG HS
CHOU ML
RUI TN
Citation: Kl. Lin et al., ROLE OF CAVUM SEPTUM PELLUCIDUM IN AKINETIC MUTISM OF HYDROCEPHALIC CHILDREN, Pediatric neurology, 16(2), 1997, pp. 156-159
Authors:
LIN KL
WANG HS
CHOU ML
RUI TN
Citation: Kl. Lin et al., ROLE OF CAVUM SEPTUM PELLUCIDUM IN AKINETIC MUTISM OF HYDROCEPHALIC CHILDREN, Pediatric neurology, 16(2), 1997, pp. 156-159
Authors:
FANG LS
HUANG SP
LIN KL
Citation: Ls. Fang et al., HIGH-TEMPERATURE INDUCES THE SYNTHESIS OF HEAT-SHOCK PROTEINS AND THEELEVATION OF INTRACELLULAR CALCIUM IN THE CORAL ACROPORA-GRANDIS, Coral reefs, 16(2), 1997, pp. 127-131
Authors:
LIN KL
CHAO WH
WU CD
Citation: Kl. Lin et al., THE PERFORMANCE AND DEGRADATION BEHAVIORS OF THE TIALN INTERLAYER COATINGS ON DRILLS/, Surface & coatings technology, 89(3), 1997, pp. 279-284
Authors:
LIN KL
CHUE CH
KOU BC
Citation: Kl. Lin et al., DEFORMATION AND CORROSION OF HOT-DIP GALVANIZED COATINGS, Materials chemistry and physics, 50(1), 1997, pp. 82-87
Authors:
LIN KL
CHEN SK
Citation: Kl. Lin et Sk. Chen, THE INTERDIFFUSION AND THE FEASIBILITY OF AL MO/NI/(PB-SN) AS A SOLDER BUMP SYSTEM/, Thin solid films, 295(1-2), 1997, pp. 218-223
Authors:
LIN KL
YANG DP
YAO JC
Citation: Kl. Lin et al., GENERALIZED VECTOR VARIATIONAL-INEQUALITIES, Journal of optimization theory and applications, 92(1), 1997, pp. 117-125
Authors:
LIN KL
CHANG SY
Citation: Kl. Lin et Sy. Chang, APPROACHING A UNIFORM BUMP HEIGHT OF THE ELECTROPLATED SOLDER BUMPS ON A SILICON-WAFER, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(4), 1996, pp. 747-751
Authors:
LIN KL
CHEN CJ
Citation: Kl. Lin et Cj. Chen, THE INTERACTIONS BETWEEN IN-SN SOLDERS AND AN ELECTROLESS NI-P DEPOSIT UPON HEAT-TREATMENT, Journal of materials science. Materials in electronics, 7(6), 1996, pp. 397-401
Authors:
LIN KL
HAAS CT
Citation: Kl. Lin et Ct. Haas, MULTIPLE HEAVY LIFTS OPTIMIZATION, Journal of construction engineering and management, 122(4), 1996, pp. 354-362