Citation: C. Zheng et al., PARTIAL TRANSIENT LIQUID-PHASE BONDING OF SI3N4 WITH TI CU/NI MULTI-INTERLAYERS/, Journal of materials science letters, 16(24), 1997, pp. 2026-2028
Citation: Hq. Lou et al., EFFECT OF DEPOSITION CONDITIONS ON THE CHARACTERISTICS OF REACTIVELY SPUTTERED TITANIUM NITRIDE FILMS, Surface & coatings technology, 90(1-2), 1997, pp. 123-127