Authors: OGUIBE CN MANNAN SH WHALLEY DC WILLIAMS DJ

Citation: Cn. Oguibe et al., CONDUCTION MECHANISMS IN ANISOTROPIC CONDUCTING ADHESIVE ASSEMBLY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(2), 1998, pp. 235-242

Authors: MANNAN SH WILLIAMS DJ WHALLEY DC

Citation: Sh. Mannan et al., SOME OPTIMUM PROCESSING PROPERTIES FOR ANISOTROPIC CONDUCTIVE ADHESIVES FOR FLIP-CHIP INTERCONNECTION, Journal of materials science. Materials in electronics, 8(4), 1997, pp. 223-231

Authors: MANNAN SH

Citation: Sh. Mannan, CONFERENCE REPORT ON THE 1995 JAPAN ONAL-ELECTRONIC-MANUFACTURING-TECHNOLOGY-SYMPOSIUM, JOURNAL OF ELECTRONICS MANUFACTURING, 6(1), 1996, pp. 65-66

Authors: OGUNJIMI AO MANNAN SH WHALLEY DC WILLIAMS DJ

Citation: Ao. Ogunjimi et al., THE ASSEMBLY PROCESS FOR ANISOTROPIC CONDUCTIVE JOINTS - SOME NEW EXPERIMENTAL AND THEORETICAL RESULTS, JOURNAL OF ELECTRONICS MANUFACTURING, 5(4), 1995, pp. 263-271

Authors: MANNAN SH EKERE NN ISMAIL I CURRIE MA

Citation: Sh. Mannan et al., FLOW PROCESSES IN SOLDER PASTE DURING STENCIL PRINTING FOR SMT ASSEMBLY, Journal of materials science. Materials in electronics, 6(1), 1995, pp. 34-42

Authors: MANNAN SH EKERE NN ISMAIL I LO EK

Citation: Sh. Mannan et al., SQUEEGEE DEFORMATION STUDY IN THE STENCIL PRINTING OF SOLDER PASTES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 17(3), 1994, pp. 470-476