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Authors: RZEPKA S BANERJEE K MEUSEL E HU CM
Citation: S. Rzepka et al., CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE-ELEMENT SIMULATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 406-411

Authors: KUCHENMEISTER F BOTTCHER M MEUSEL E MEIER D
Citation: F. Kuchenmeister et al., CONDUCTIVE POLYMERS FOR MICROELECTRONIC PACKAGING - CHIP BONDING TO POLYMER-FILMS, Polymers for advanced technologies, 9(10-11), 1998, pp. 806-811

Authors: KUECHENMEISTER F MEUSEL E
Citation: F. Kuechenmeister et E. Meusel, POLYPYRROLE AS AN INTERLAYER FOR BONDING CONDUCTIVE ADHESIVES TO ACTIVATED ALUMINUM BOND PADS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(1), 1997, pp. 9-14
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