Citation: S. Rzepka et al., CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE-ELEMENT SIMULATION, IEEE transactions on components, packaging, and manufacturing technology. Part A, 21(3), 1998, pp. 406-411
Authors:
KUCHENMEISTER F
BOTTCHER M
MEUSEL E
MEIER D
Citation: F. Kuchenmeister et al., CONDUCTIVE POLYMERS FOR MICROELECTRONIC PACKAGING - CHIP BONDING TO POLYMER-FILMS, Polymers for advanced technologies, 9(10-11), 1998, pp. 806-811
Citation: F. Kuechenmeister et E. Meusel, POLYPYRROLE AS AN INTERLAYER FOR BONDING CONDUCTIVE ADHESIVES TO ACTIVATED ALUMINUM BOND PADS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(1), 1997, pp. 9-14