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Results:
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Results: 4
Thermo-mechanical finite element analysis in press-packed IGBT design
Authors:
Pirondi, A Nicoletto, G Cova, P Pasqualetti, M Portesine, M
Citation:
A. Pirondi et al., Thermo-mechanical finite element analysis in press-packed IGBT design, MICROEL REL, 40(7), 2000, pp. 1163-1172
Accelerated life testing and thermomechanical simulation in power electronic device development
Authors:
Nicoletto, G Pirondi, A Cova, P
Citation:
G. Nicoletto et al., Accelerated life testing and thermomechanical simulation in power electronic device development, J STRAIN A, 34(6), 1999, pp. 455-462
Power cycling on press-pack IGBTs: measurements and thermomechanical simulation
Authors:
Cova, P Nicoletto, G Pirondi, A Portesine, M Pasqualetti, M
Citation:
P. Cova et al., Power cycling on press-pack IGBTs: measurements and thermomechanical simulation, MICROEL REL, 39(6-7), 1999, pp. 1165-1170
Thermo-mechanical simulation of a multichip press-packed IGBT
Authors:
Pirondi, A Nicoletto, G Cova, P Pasqualetti, M Portesine, M Zani, PE
Citation:
A. Pirondi et al., Thermo-mechanical simulation of a multichip press-packed IGBT, SOL ST ELEC, 42(12), 1998, pp. 2303-2307
Risultati:
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