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Results:
1-3
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Results: 3
Can macroscopic oxide thickness uniformity improve oxide reliability?
Authors:
Wu, EY Nowak, EJ Vollertsen, RP
Citation:
Ey. Wu et al., Can macroscopic oxide thickness uniformity improve oxide reliability?, IEEE ELEC D, 21(8), 2000, pp. 402-404
Weibull breakdown characteristics and oxide thickness uniformity
Authors:
Wu, EY Nowak, EJ Vollertsen, RP Han, LK
Citation:
Ey. Wu et al., Weibull breakdown characteristics and oxide thickness uniformity, IEEE DEVICE, 47(12), 2000, pp. 2301-2309
Process variability
Authors:
Bernstein, K Carrig, KM Durham, CM Hansen, PR Hogenmiller, D Nowak, EJ Rohrer, NJ
Citation:
K. Bernstein et al., Process variability, HIGH SPEED CMOS DESIGN STYLES, 1999, pp. 1-50
Risultati:
1-3
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