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Authors:
Sakaizumi, T
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Citation: T. Yoshioka et al., Effect of oxygen content in copper on the tensile strength of diffusion bonding joints between copper and several metals, J JPN METAL, 63(8), 1999, pp. 1036-1042
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Citation: Y. Isoda et al., Thermal shock resistance and thermoelectric properties of boron doped irondisilicides, J JPN METAL, 63(3), 1999, pp. 391-396
Citation: Y. Isoda et al., Electronic conduction mechanism in thermoelectric semiconductor of boron-doped iron disilicides, J JPN METAL, 63(11), 1999, pp. 1372-1376