AAAAAA

   
Results: 1-13 |
Results: 13
MSA3 UNIDIRECTIONAL FREEZE-THAW TEST FOR MASONRY UNITS AND WALLETTES
Authors: BINDA L DEVEKEV B ACHARHABI A BARONIO G BEKKER P BORCHELT G BRIGHT N EMRICH F FORDE M GALLEGOS H GROOT C HEDSTROM E LAWRENCE S MAURENBRECHER P MODENA C PAGE A PIRES F PUME D ROBERTS J ROSSI PP SCHMIDT S SCHUBERT P SCHULLER M STOCKL S WEST T
Citation: L. Binda et al., MSA3 UNIDIRECTIONAL FREEZE-THAW TEST FOR MASONRY UNITS AND WALLETTES, Materials and structures, 31(212), 1998, pp. 513-519
MSB5 DETERMINATION OF THE DAMAGE TO WALLETTES CAUSED BY ACID-RAIN
Authors: BINDA L DEVEKEY B ACHARHABI A BARONIO G BEKKER P BORCHELT G BRIGHT N EMRICH F FORDE M GALLEGOS H GROOT C HEDSTROM E LAWRENCE S MAURENBRECHER P MODENA C PAGE A PIRES F PUME D ROBERTS J ROSSI PP SCHMIDT S SCHUBERT P SCHULLER M STOCKL S WEST T
Citation: L. Binda et al., MSB5 DETERMINATION OF THE DAMAGE TO WALLETTES CAUSED BY ACID-RAIN, Materials and structures, 31(212), 1998, pp. 519-521
RILEM TC 127-MS - TESTS FOR MASONRY MATERIALS AND STRUCTURES
Authors: BINDA L DEVEKEY B ACHARHABI A BARONIO G BEKKER P BORCHELT G BRIGHT N EMRICH F FORDE M GALLEGOS H GROOT C HEDSTROM E LAWRENCE S MAURENBRECHER P MODENA C PAGE A PIRES F PUME D ROBERTS J ROSSI PP SCHMIDT S SCHUBERT P SCHULLER M SCHWARTZ J STOCKL S WEST T
Citation: L. Binda et al., RILEM TC 127-MS - TESTS FOR MASONRY MATERIALS AND STRUCTURES, Materials and structures, 31(205), 1998, pp. 2-19
POST ETCH CLEANING OF LOW-K DIELECTRIC MATERIALS FOR ADVANCED INTERCONNECTS - CHARACTERIZATION AND PROCESS OPTIMIZATION
Authors: LOUIS D LAJOINIE E PIRES F LEE WM HOLMES D
Citation: D. Louis et al., POST ETCH CLEANING OF LOW-K DIELECTRIC MATERIALS FOR ADVANCED INTERCONNECTS - CHARACTERIZATION AND PROCESS OPTIMIZATION, Microelectronic engineering, 42, 1998, pp. 415-418
INTEGRATION OF A STACK OF 2 FLUORINE-DOPED SILICON-OXIDE THIN-FILMS WITH INTERCONNECT METALLIZATION FOR A SUB-0.35 MU-M INTER-METAL DIELECTRIC APPLICATION
Authors: BAUD L PASSEMARD G GOBIL Y MSAAD H CORTE A PIRES F FUGIER P NOEL P RABINZOHN P BEINGLASS I
Citation: L. Baud et al., INTEGRATION OF A STACK OF 2 FLUORINE-DOPED SILICON-OXIDE THIN-FILMS WITH INTERCONNECT METALLIZATION FOR A SUB-0.35 MU-M INTER-METAL DIELECTRIC APPLICATION, Microelectronic engineering, 37-8(1-4), 1997, pp. 261-269
INTEGRATION EVALUATION OF LOW PERMITTIVITY SILICON-BASED SPIN ON MATERIALS AS IMD
Authors: PIRES F NOEL P LECORNEC C PASSEMARD G LOUIS D LAJOINIE E
Citation: F. Pires et al., INTEGRATION EVALUATION OF LOW PERMITTIVITY SILICON-BASED SPIN ON MATERIALS AS IMD, Microelectronic engineering, 37-8(1-4), 1997, pp. 277-284
STUDY OF FLUORINE STABILITY IN FLUORO-SILICATE GLASS AND EFFECTS ON DIELECTRIC-PROPERTIES
Authors: PASSEMARD G FUGIER P NOEL P PIRES F DEMOLLIENS O
Citation: G. Passemard et al., STUDY OF FLUORINE STABILITY IN FLUORO-SILICATE GLASS AND EFFECTS ON DIELECTRIC-PROPERTIES, Microelectronic engineering, 33(1-4), 1997, pp. 335-342
STUDY OF THE THERMAL-STABILITY AT THE CU SIOF INTERFACE/
Authors: LABIADH A BRAUD F TORRES J PALLEAU J PASSEMARD G PIRES F DUPUY JC DUBOIS C GAUTIER B
Citation: A. Labiadh et al., STUDY OF THE THERMAL-STABILITY AT THE CU SIOF INTERFACE/, Microelectronic engineering, 33(1-4), 1997, pp. 369-375
NEW DECONTAMINANTS - DESTRUCTION OF TOXIC ORGANOPHOSPHORUS AND SULFUR-COMPOUNDS USING MONOPEROXIPHOSPHORIC ACID
Authors: LION C HEDAYATULLAH M PIRES F CHARVY C BRIAND S MAGNAUD G DELMAS G SENTENACROUMANOU H
Citation: C. Lion et al., NEW DECONTAMINANTS - DESTRUCTION OF TOXIC ORGANOPHOSPHORUS AND SULFUR-COMPOUNDS USING MONOPEROXIPHOSPHORIC ACID, Phosphorus, sulfur and silicon and the related elements, 118, 1996, pp. 89-94
NEW DECONTAMINANTS - RAPID TOTAL MILD DES TRUCTION OF DIAZINON, A PHOSPHOROTHIOATE INSECTICIDE, USING MAGNESIUM MONOPERPHTHALATE
Authors: LION C SOUBEYRAN V HEDAYATULLAH M ABOUTEIM O PIRES F CHARVY C
Citation: C. Lion et al., NEW DECONTAMINANTS - RAPID TOTAL MILD DES TRUCTION OF DIAZINON, A PHOSPHOROTHIOATE INSECTICIDE, USING MAGNESIUM MONOPERPHTHALATE, Phosphorus, sulfur and silicon and the related elements, 113(1-4), 1996, pp. 307-309
CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN
Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN
Authors: MERMET JL MOUCHE MJ PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Jl. Mermet et al., CVD COPPER DEPOSITION FROM CU-I(HFAC)TMVS STUDIED THROUGH A MODELING EXPERIMENTAL-DESIGN, Journal de physique. IV, 5(C5), 1995, pp. 517-523
PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN
Authors: MOUCHE MJ MERMET JL PIRES F RICHARD E TORRES J PALLEAU J BRAUD F
Citation: Mj. Mouche et al., PROCESS OPTIMIZATION OF COPPER MOCVD USING MODELING EXPERIMENTAL-DESIGN, Applied surface science, 91(1-4), 1995, pp. 129-133
Risultati: 1-13 |