AAAAAA

   
Results: 1-9 |
Results: 9
MORPHOLOGY OF CORROSION PITS IN ALUMINUM THIN-FILM METALLIZATIONS
Authors: PROOST J BAKLANOV M VERBEECK R MAEX K
Citation: J. Proost et al., MORPHOLOGY OF CORROSION PITS IN ALUMINUM THIN-FILM METALLIZATIONS, JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2(3), 1998, pp. 150-155
THE ROLE OF GRAIN-BOUNDARY STRUCTURE ON ELECTROMIGRATION-INDUCED DRIFT IN PURE AL AND AL(0.5WT-PERCENT CU)
Authors: PROOST J SAMAJDAR I VERLINDEN B VANHOUTTE P MAEX K DELAEY L
Citation: J. Proost et al., THE ROLE OF GRAIN-BOUNDARY STRUCTURE ON ELECTROMIGRATION-INDUCED DRIFT IN PURE AL AND AL(0.5WT-PERCENT CU), Scripta materialia, 39(8), 1998, pp. 1039-1045
CRITICAL ROLE OF DEGASSING FOR HOT ALUMINUM FILLING
Authors: PROOST J KONDOH E VEREECKE G HEYNS M MAEX K
Citation: J. Proost et al., CRITICAL ROLE OF DEGASSING FOR HOT ALUMINUM FILLING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 16(4), 1998, pp. 2091-2098
STUDY OF CU DIFFUSION IN AN AL-1 WT-PERCENT-SI-0.5 WT-PERCENT-CU BONDPAD WITH AN AL-1 WT-PERCENT-SI BOND WIRE ATTACHED USING SCANNING ELECTRON-MICROSCOPY
Authors: COSEMANS P DHAEN J WITVROUW A PROOST J DOLIESLAEGER M DECEUNINCK W MAEX K DESCHEPPER L
Citation: P. Cosemans et al., STUDY OF CU DIFFUSION IN AN AL-1 WT-PERCENT-SI-0.5 WT-PERCENT-CU BONDPAD WITH AN AL-1 WT-PERCENT-SI BOND WIRE ATTACHED USING SCANNING ELECTRON-MICROSCOPY, Microelectronics and reliability, 38(3), 1998, pp. 309-315
ELECTROMIGRATION THRESHOLD IN DAMASCENE VERSUS PLASMA-ETCHED INTERCONNECTS
Authors: PROOST J MAEX K DELAEY L
Citation: J. Proost et al., ELECTROMIGRATION THRESHOLD IN DAMASCENE VERSUS PLASMA-ETCHED INTERCONNECTS, Applied physics letters, 73(19), 1998, pp. 2748-2750
GLASSES AND BIOGLASSES - SYNTHESIS AND COATINGS
Authors: HELSEN JA PROOST J SCHROOTEN J TIMMERMANS G BRAUNS E VANDERSTRAETEN J
Citation: Ja. Helsen et al., GLASSES AND BIOGLASSES - SYNTHESIS AND COATINGS, Journal of the European Ceramic Society, 17(2-3), 1997, pp. 147-152
STRESS-RELAXATION IN AL(CU) THIN-FILMS
Authors: PROOST J WITVROUW A COSEMANS P ROUSSEL P MAEX K
Citation: J. Proost et al., STRESS-RELAXATION IN AL(CU) THIN-FILMS, Microelectronic engineering, 33(1-4), 1997, pp. 137-147
VOLUNTARY REGULATION AND FARMERS ENVIRONMENTAL BEHAVIOR IN DENMARK AND THE NETHERLANDS
Authors: BAGER T PROOST J
Citation: T. Bager et J. Proost, VOLUNTARY REGULATION AND FARMERS ENVIRONMENTAL BEHAVIOR IN DENMARK AND THE NETHERLANDS, Sociologia ruralis, 37(1), 1997, pp. 79
INTEGRATED FARMING IN THE NETHERLANDS - FLIRTATION OR SOLID CHANGE
Authors: PROOST J MATTESON P
Citation: J. Proost et P. Matteson, INTEGRATED FARMING IN THE NETHERLANDS - FLIRTATION OR SOLID CHANGE, Outlook on Agriculture, 26(2), 1997, pp. 87-94
Risultati: 1-9 |