Authors:
Pinardi, K
Lai, ZH
Vogel, D
Kang, YL
Liu, J
Liu, S
Haug, R
Willander, M
Citation: K. Pinardi et al., Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints, IEEE T COMP, 23(3), 2000, pp. 447-451