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Results:
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Results: 2
Device level modeling of metal-insulator-semiconductor interconnects
Authors:
Wang, GF Qi, XN Yu, ZP Dutton, RW
Citation:
Gf. Wang et al., Device level modeling of metal-insulator-semiconductor interconnects, IEEE DEVICE, 48(8), 2001, pp. 1672-1682
A fast 3-D modeling approach to electrical parameters extraction of bonding wires for RF circuits
Authors:
Qi, XN Yue, CP Arnborg, T Soh, HT Sakai, H Yu, ZP Dutton, RW
Citation:
Xn. Qi et al., A fast 3-D modeling approach to electrical parameters extraction of bonding wires for RF circuits, IEEE T AD P, 23(3), 2000, pp. 480-488
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