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Results:
1-8
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Results: 8
Authors:
SUN X
REID JS
KOLAWA E
NICOLET MA
RUIZ RP
Citation: X. Sun et al., REACTIVELY SPUTTERED TI-SI-N FILMS .2. DIFFUSION-BARRIERS FOR AL AND CU METALLIZATIONS ON SI, Journal of applied physics, 81(2), 1997, pp. 664-671
Authors:
SHALISH I
GASSER SM
KOLAWA E
NICOLET MA
RUIZ RP
Citation: I. Shalish et al., GOLD METALLIZATION FOR ALUMINUM NITRIDE, Thin solid films, 289(1-2), 1996, pp. 166-169
Authors:
REID JS
KOLAWA E
GARLAND CM
NICOLET MA
CARDONE F
GUPTA D
RUIZ RP
Citation: Js. Reid et al., AMORPHOUS (MO, TA, OR W)-SI-N DIFFUSION-BARRIERS FOR AL METALLIZATIONS, Journal of applied physics, 79(2), 1996, pp. 1109-1115
Authors:
REID JS
LIU RY
SMITH PM
RUIZ RP
NICOLET MA
Citation: Js. Reid et al., W-B-N DIFFUSION-BARRIERS FOR SI CU METALLIZATIONS/, Thin solid films, 262(1-2), 1995, pp. 218-223
Authors:
CHEN JS
KOLAWA E
NICOLET MA
RUIZ RP
BAUD L
JAUSSAUD C
MADAR R
Citation: Js. Chen et al., SOLID-STATE REACTION OF PT THIN-FILM WITH SINGLE-CRYSTAL (001) BETA-SIC, Journal of materials research, 9(3), 1994, pp. 648-657
Authors:
CHEN JS
KOLAWA E
NICOLET MA
RUIZ RP
BAUD L
JAUSSAUD C
MADAR R
Citation: Js. Chen et al., REACTION OF TA THIN-FILM WITH SINGLE-CRYSTALLINE (001) BETA-SIC, Journal of applied physics, 76(4), 1994, pp. 2169-2175
Authors:
CHEN JS
KOLAWA E
NICOLET MA
RUIZ RP
Citation: Js. Chen et al., OHMIC CONTACTS TO N-GAAS WITH A PT GE/AU CONTACTING LAYER AND A TA-SI-N BARRIER - ELECTRICAL AND METALLURGICAL CHARACTERISTICS/, Journal of applied physics, 75(11), 1994, pp. 7373-7381
Authors:
REID JS
KOLAWA E
RUIZ RP
NICOLET MA
Citation: Js. Reid et al., EVALUATION OF AMORPHOUS (MO, TA, W)-SI-N DIFFUSION-BARRIERS FOR [SI] CU METALLIZATIONS/, Thin solid films, 236(1-2), 1993, pp. 319-324
Risultati:
1-8
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