Authors:
NIELSEN MC
KIM JY
RYMASZEWSKI EJ
LU TM
BAKHRU H
Citation: Mc. Nielsen et al., COMPOSITE AND MULTILAYERED TAOX-TIOY HIGH DIELECTRIC-CONSTANT THIN-FILMS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(3), 1998, pp. 274-280
Authors:
CHEN K
NIELSEN M
SOSS S
RYMASZEWSKI EJ
LU TM
WAN CT
Citation: K. Chen et al., STUDY OF TANTALUM OXIDE THIN-FILM CAPACITORS ON METALLIZED POLYMER SHEETS FOR ADVANCED PACKAGING APPLICATIONS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(2), 1997, pp. 117-122
Authors:
CHEN K
NIELSEN M
YANG GR
RYMASZEWSKI EJ
LU TM
Citation: K. Chen et al., STUDY OF AMORPHOUS TA2O5 THIN-FILMS BY DC MAGNETRON REACTIVE SPUTTERING, Journal of electronic materials, 26(4), 1997, pp. 397-401
Citation: K. Chen et al., STUDY OF ELECTRON TRAPPING IN THE AMORPHOUS TANTALUM OXIDE THIN-FILMSPREPARED BY DC MAGNETRON REACTIVE SPUTTERING, Materials chemistry and physics, 49(1), 1997, pp. 42-45
Authors:
CHEN K
YANG GR
NIELSEN M
LU TM
RYMASZEWSKI EJ
Citation: K. Chen et al., X-RAY PHOTOELECTRON-SPECTROSCOPY STUDY OF AL TA2O5 AND TA2O5/AL BURIED INTERFACES/, Applied physics letters, 70(3), 1997, pp. 399-401
Citation: Xm. Wu et al., DIELECTRIC-CONSTANT DEPENDENCE OF POOLE-FRENKEL POTENTIAL IN TANTALUMOXIDE THIN-FILMS, Materials chemistry and physics, 38(3), 1994, pp. 297-300
Authors:
LIU WT
COCHRANE S
WU XM
SINGH PK
ZHANG X
KNORR DB
MCDONALD JF
RYMASZEWSKI EJ
BORREGO JM
LU TM
Citation: Wt. Liu et al., FREQUENCY-DOMAIN (1KHZ-40GHZ) CHARACTERIZATION OF THIN-FILMS FOR MULTICHIP-MODULE PACKAGING TECHNOLOGY, Electronics Letters, 30(2), 1994, pp. 117-118
Authors:
LIU WT
COCHRANE S
LAKSHMIKUMAR ST
KNORR DB
RYMASZEWSKI EJ
BORREGO JM
LU TM
Citation: Wt. Liu et al., LOW-TEMPERATURE FABRICATION OF AMORPHOUS BATIO3 THIN-FILM BYPASS CAPACITORS, IEEE electron device letters, 14(7), 1993, pp. 320-322
Citation: Db. Knorr et Ej. Rymaszewski, A UNIQUE APPROACH TO TEACHING ELECTRONIC PACKAGING, IEEE transactions on components, hybrids, and manufacturing technology, 16(1), 1993, pp. 157-163