AAAAAA

   
Results: 1-9 |
Results: 9
In-situ electrical study of a reversible surface modification and a nanomachining of gold microstrips by the voltage-biased atomic force microscope tip in air
Authors: Kim, BM Min, YS Lee, NS Sok, JH Kim, MK Chae, SD Ryu, W Chae, HS
Citation: Bm. Kim et al., In-situ electrical study of a reversible surface modification and a nanomachining of gold microstrips by the voltage-biased atomic force microscope tip in air, JPN J A P 1, 40(6B), 2001, pp. 4340-4343
Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection
Authors: Kim, N Sung, M Kim, H Baek, S Ryu, W An, JG Kim, J
Citation: N. Kim et al., Reduction of crosstalk noise in modular jack for high-speed differential signal interconnection, IEEE T AD P, 24(3), 2001, pp. 260-267
High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm
Authors: Ryu, W Yim, MJ Ahn, S Lee, J Kim, W Paik, KW Kim, J
Citation: W. Ryu et al., High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm, IEEE T COMP, 23(3), 2000, pp. 542-545
RF interconnect for multi-Gbit/s board-level clock distribution
Authors: Ryu, W Lee, J Kim, H Ahn, S Kim, N Choi, B Kam, D Kim, J
Citation: W. Ryu et al., RF interconnect for multi-Gbit/s board-level clock distribution, IEEE T AD P, 23(3), 2000, pp. 398-407
Embedded microstrip interconnection lines for gigahertz digital circuits
Authors: Ryu, W Baik, SH Kim, H Kim, J Sung, MH Kim, J
Citation: W. Ryu et al., Embedded microstrip interconnection lines for gigahertz digital circuits, IEEE T AD P, 23(3), 2000, pp. 495-503
An efficient crosstalk parameter extraction method for high-speed interconnection lines
Authors: Sung, MH Ryu, W Kim, H Kim, J Kim, J
Citation: Mh. Sung et al., An efficient crosstalk parameter extraction method for high-speed interconnection lines, IEEE T AD P, 23(2), 2000, pp. 148-155
Electrical and thermal modelling of QFN packages
Authors: Lu, ACW Xie, DJ Shi, ZF Ryu, W
Citation: Acw. Lu et al., Electrical and thermal modelling of QFN packages, PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, pp. 352-356
Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications
Authors: Yim, MJ Ryu, W Jeon, YD Lee, J Ahn, S Kim, J Paik, KW
Citation: Mj. Yim et al., Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications, IEEE T COMP, 22(4), 1999, pp. 575-581
Microwave modeling and characterization of anisotropic conductive adhesiveflip-chip interconnection
Authors: Yim, MJ Jeon, YD Paik, KW Ryu, W Lee, J Kim, J
Citation: Mj. Yim et al., Microwave modeling and characterization of anisotropic conductive adhesiveflip-chip interconnection, J KOR PHYS, 35, 1999, pp. S753-S758
Risultati: 1-9 |