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Results:
1-10
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Results: 10
Authors:
SCHULZ SE
EVANS JP
Citation: Se. Schulz et Jp. Evans, SPATIAL VARIABILITY IN MICROSCOPIC DEFORMATION AND COMPOSITION OF THEPUNCHBOWL FAULT, SOUTHERN CALIFORNIA - IMPLICATIONS FOR MECHANISMS, FLUID-ROCK INTERACTION, AND FAULT MORPHOLOGY, Tectonophysics, 295(1-2), 1998, pp. 223-244
Authors:
ROBER J
RIEDEL S
SCHULZ SE
GESSNER T
Citation: J. Rober et al., INFLUENCE OF CARRIER GAS ON CU NUCLEATION, FILM PROPERTIES AND MOCVD REACTION-KINETICS, Microelectronic engineering, 37-8(1-4), 1997, pp. 111-119
Authors:
RIEDEL S
ROBER J
SCHULZ SE
GESSNER T
Citation: S. Riedel et al., STRESS IN COPPER-FILMS FOR INTERCONNECTS, Microelectronic engineering, 37-8(1-4), 1997, pp. 151-156
Authors:
SCHULZ SE
WEIDNER JO
HASSE W
Citation: Se. Schulz et al., ENHANCED RELIABILITY OF W-ENCAPSULATED ALSI-INTERCONNECTIONS USING SELECTIVE W-CVD, Microelectronic engineering, 33(1-4), 1997, pp. 113-120
Authors:
SCHULZ SE
HINTZE B
GRUNEWALD W
FIEDLER O
GESSNER T
Citation: Se. Schulz et al., EVALUATION OF SELECTIVE TUNGSTEN PLUGS ON TIN, W AND ALSI BY ANALYTICAL AND ELECTRICAL MEASUREMENTS, Applied surface science, 91(1-4), 1995, pp. 326-331
Authors:
WOLF H
STREITER R
SCHULZ SE
GESSNER T
Citation: H. Wolf et al., GROWTH-RATE MODELING FOR SELECTIVE TUNGSTEN LPCVD, Applied surface science, 91(1-4), 1995, pp. 332-338
Authors:
GRUNEWALD W
SCHULZ SE
Citation: W. Grunewald et Se. Schulz, CROSS-SECTION TEM FOR EXAMINATIONS OF SELECTIVE TUNGSTEN CVD FOR VIA HOLE FILLING, Fresenius' journal of analytical chemistry, 349(1-3), 1994, pp. 239-240
Authors:
SCHULZ SE
HINTZE B
GRUNEWALD W
HOFMANN A
Citation: Se. Schulz et al., INFLUENCE OF WATER WAFER PRECLEAN BEFORE SELECTIVE TUNGSTEN CVD ON SURFACE-PROPERTIES INTERCONNECT AND INTERMETAL DIELECTRIC MATERIALS, Physica status solidi. a, Applied research, 145(2), 1994, pp. 311-318
Authors:
SCHULZ SE
HINTZE B
GESSNER T
WOLF H
GRUENEWALD W
Citation: Se. Schulz et al., SELECTIVE TUNGSTEN CVD ON SPUTTERED TUNGSTEN FOR VIA FILL, Applied surface science, 73, 1993, pp. 42-50
Authors:
GRUENEWALD W
SCHULZ SE
HINTZE B
GESSNER T
Citation: W. Gruenewald et al., INTERFACE REACTIONS BETWEEN CVD AND PVD TUNGSTEN AND ALUMINUM, Applied surface science, 73, 1993, pp. 290-294
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1-10
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