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Results:
1-7
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Results: 7
Authors:
LEE S
MANNO VP
SIMONS RE
Citation: S. Lee et al., SEMITHERM XIII - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 382-383
Authors:
MANNO VP
SIMONS RE
TARTER TS
Citation: Vp. Manno et al., SEMITHERM-XII - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 449-450
Authors:
MANNO VP
SIMONS RE
Citation: Vp. Manno et Re. Simons, CONTRIBUTIONS FROM THE SEMITHERM-XI CONFERENCE - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 721-722
Authors:
VADER DT
CHRYSLER GM
CHU RC
SIMONS RE
Citation: Dt. Vader et al., EXPERIMENTAL INVESTIGATION OF SUBCOOLED LIQUID-NITROGEN IMPINGEMENT COOLING OF A SILICON CHIP, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 788-794
Authors:
SIMONS RE
Citation: Re. Simons, THE EVOLUTION OF IBM HIGH-PERFORMANCE COOLING TECHNOLOGY, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(4), 1995, pp. 805-811
Authors:
CHRYSLER GM
CHU RC
SIMONS RE
Citation: Gm. Chrysler et al., JET IMPINGEMENT BOILING OF A DIELECTRIC COOLANT IN NARROW GAPS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(3), 1995, pp. 527-533
Authors:
MANNO VP
SIMONS RE
Citation: Vp. Manno et Re. Simons, CONTRIBUTIONS FROM THE 10TH SEMITHERM SYMPOSIUM - FOREWORD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 18(1), 1995, pp. 30-30
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1-7
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