Authors: DEUTSCH A SUROVIC CW CAMPBELL JS COTEUS PW LANZETTA AP HOLTON JT KNIGHT AD

Citation: A. Deutsch et al., ELECTRICAL CHARACTERISTICS OF HIGH-PERFORMANCE PIN-IN-SOCKET AND PAD-ON-PAD CONNECTORS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 20(1), 1997, pp. 64-77

Authors: DEUTSCH A KOPCSAY GV RESTLE PJ SMITH HH KATOPIS G BECKER WD COTEUS PW SUROVIC CW RUBIN BJ DUNNE RP GALLO T JENKINS KA TERMAN LM DENNARD RH SAIHALASZ GA KRAUTER BL KNEBEL DR

Citation: A. Deutsch et al., WHEN ARE TRANSMISSION-LINE EFFECTS IMPORTANT FOR ON-CHIP INTERCONNECTIONS, IEEE transactions on microwave theory and techniques, 45(10), 1997, pp. 1836-1846

Authors: DEUTSCH A SUROVIC CW LANZETTA AP AINSPAN HA ABBIATE JC VEIHBECK A HEDRICK JC SHAW JM TISDALE SL FOSTER EF COTEUS PW

Citation: A. Deutsch et al., BROAD-BAND CHARACTERIZATION OF LOW DIELECTRIC-CONSTANT AND LOW DIELECTRIC LOSS CYTUF(TM) CYANATE ESTER PRINTED-CIRCUIT BOARD MATERIAL, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(2), 1996, pp. 331-337

Authors: DEUTSCH A KOPCSAY GV SUROVIC CW RUBIN BJ TERMAN LM DUNNE RP GALLO TA DENNARD RH

Citation: A. Deutsch et al., MODELING AND CHARACTERIZATION OF LONG ON-CHIP INTERCONNECTIONS FOR HIGHPERFORMANCE MICROPROCESSORS, IBM journal of research and development, 39(5), 1995, pp. 547-567

Authors: DEUTSCH A SWAMINATHAN M REE MH SUROVIC CW ARJAVALINGAM G PRASAD K MCHERRON DC MCALLISTER M KOPCSAY GV GIRI AP PERFECTO E WHITE GE

Citation: A. Deutsch et al., MEASUREMENT OF DIELECTRIC ANISOTROPY OF BPDA-PDA POLYIMIDE IN MULTILAYER THIN-FILM PACKAGES, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 17(4), 1994, pp. 486-492

Authors: DEUTSCH A ARJAVALINGAM G SUROVIC CW LANZETTA AP FOGEL KE DOANY F RITTER MB

Citation: A. Deutsch et al., PERFORMANCE LIMITS OF ELECTRICAL CABLES FOR INTRASYSTEM COMMUNICATION, IBM journal of research and development, 38(6), 1994, pp. 659-672