Authors:
Zschech, E
Engelmann, HJ
Saage, H
de Robillard, Q
Stegmann, H
Citation: E. Zschech et al., Characterization of layer stacks in microelectronic products: Challenges to sample preparation and TEM analysis, PRAKT METAL, 38(8), 2001, pp. 442-453
Citation: Hj. Engelmann et al., Application of analytical TEM for failure analysis of semiconductor devicestructures, MICROEL REL, 40(8-10), 2000, pp. 1747-1751