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Citation: Rv. Gol'Dshtein et Me. Sarychev, Influence of vacancies on the surface tension at the interface between twomaterials, DOKL PHYS, 46(10), 2001, pp. 708-710

Authors: Goldstein, RV Sarychev, ME Shirabaikin, DB Vladimirov, AS Zhitnikov, YV

Citation: Rv. Goldstein et al., Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits, INT J FRACT, 109(1), 2001, pp. 91-121

Authors: Sarychev, ME Zhitnikov, YV Borucki, L Liu, CL Makhviladze, TM

Citation: Me. Sarychev et al., A new, general model for mechanical stress evolution during electromigration, THIN SOL FI, 365(2), 2000, pp. 211-218

Authors: Sarychev, ME Zhitnikov, YV Borucki, L Liu, CL Makhviladze, TM

Citation: Me. Sarychev et al., General model for mechanical stress evolution during electromigration, J APPL PHYS, 86(6), 1999, pp. 3068-3075