Authors:
Lee, JW
Jeon, MH
Devre, M
Mackenzie, KD
Johnson, D
Sasserath, JN
Pearton, SJ
Ren, F
Shul, RJ
Citation: Jw. Lee et al., Understanding of etch mechanism and etch depth distribution in inductivelycoupled plasma etching of GaAs, SOL ST ELEC, 45(9), 2001, pp. 1683-1686
Authors:
Lee, JW
Jeon, MH
Cho, GS
Yim, HC
Chang, SK
Kim, KK
Devre, M
Lee, YS
Westerman, R
Johnson, D
Sasserath, JN
Pearton, SJ
Citation: Jw. Lee et al., Utilization of optical emission spectroscopy for end-point detection during AlGaAs/GaAs and InGaP/GaAs etching in BCl3/N-2 inductively coupled plasmas, J ELCHEM SO, 148(9), 2001, pp. G472-G474
Authors:
Lee, JW
Devre, MW
Reelfs, BH
Johnson, D
Sasserath, JN
Clayton, F
Hays, D
Pearton, SJ
Citation: Jw. Lee et al., Advanced selective dry etching of GaAs/AlGaAs in high density inductively coupled plasmas, J VAC SCI A, 18(4), 2000, pp. 1220-1224
Authors:
Lee, JW
Mackenzie, KD
Johnson, D
Sasserath, JN
Pearton, SJ
Ren, F
Citation: Jw. Lee et al., Low temperature silicon nitride and silicon dioxide film processing by inductively coupled plasma chemical vapor deposition, J ELCHEM SO, 147(4), 2000, pp. 1481-1486
Authors:
Lee, JW
Westerman, R
Mackenzie, KD
Donohue, JF
Johnson, D
Sasserath, JN
Liddane, K
Pearton, SJ
Citation: Jw. Lee et al., 905 nm wavelength laser as a means for in situ end-point detection of dry etching of AlxGa1-xAs on GaAs, EL SOLID ST, 2(12), 1999, pp. 640-641