AAAAAA
Results:
1-7
|
Results: 7
Authors:
Chen, YM
Shie, JS
Citation: Ym. Chen et Js. Shie, Feasibility study on a contact-less direct thermal printing with electrothermal SPICE simulation, SENS ACTU-A, 88(2), 2001, pp. 93-103
Authors:
Lee, C
Huang, WF
Shie, JS
Citation: C. Lee et al., Wafer bonding by low-temperature soldering, SENS ACTU-A, 85(1-3), 2000, pp. 330-334
Authors:
Shie, JS
Yu, SH
Citation: Js. Shie et Sh. Yu, A micromachined silicon-submount package for vertical emission of edge emitting laser diodes, SENS ACTU-A, 82(1-3), 2000, pp. 297-301
Authors:
Lee, TS
Shie, JS
Citation: Ts. Lee et Js. Shie, Feasibility study on low-resolution uncooled thermal imagers for home-security applications, OPT ENG, 39(6), 2000, pp. 1431-1440
Authors:
Chou, BCS
Chen, CN
Shie, JS
Citation: Bcs. Chou et al., Micromachining on (111)-oriented silicon, SENS ACTU-A, 75(3), 1999, pp. 271-277
Authors:
Shie, JS
Park, JW
Citation: Js. Shie et Jw. Park, Physical characteristics of surimi seafood as affected by thermal processing conditions, J FOOD SCI, 64(2), 1999, pp. 287-290
Authors:
Ou-Yang, M
Sheen, CS
Shie, JS
Citation: M. Ou-yang et al., Parameter extraction of resistive thermal microsensors by AC electrical method, IEEE INSTR, 47(2), 1998, pp. 403-408
Risultati:
1-7
|