Authors: Shimoyama, N Machida, K Shimaya, M Akiya, H Kyuragi, H

Citation: N. Shimoyama et al., The influence of stud bumping above the MOSFETs on device reliability, IEICE T FUN, E83A(5), 2000, pp. 851-856

Authors: Shimoyama, N Machida, K Shimaya, M Koizumi, H Kyuragi, H

Citation: N. Shimoyama et al., The influence of stud bumping stress on device degradation in scaled MOSFETs, MICROEL REL, 40(2), 2000, pp. 267-275

Authors: Shimoyama, N Machida, K Shimaya, M Kyuragi, H

Citation: N. Shimoyama et al., Stress-induced device degradation due to die-attachment process after areabump formation, JPN J A P 1, 38(4B), 1999, pp. 2262-2265