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Results:
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Results: 4
Effect of BF2+ implantation on void formation in Ti-salicided narrow polysilicon lines
Authors:
Pey, KL Chua, HN Siah, SY
Citation:
Kl. Pey et al., Effect of BF2+ implantation on void formation in Ti-salicided narrow polysilicon lines, EL SOLID ST, 3(9), 2000, pp. 442-445
Void formation in titanium desilicide/p(+) silicon interface: impact on junction leakage and silicide sheet resistance
Authors:
Pey, KL Sundaresan, R Wong, H Siah, SY Tung, CH
Citation:
Kl. Pey et al., Void formation in titanium desilicide/p(+) silicon interface: impact on junction leakage and silicide sheet resistance, MAT SCI E B, 74(1-3), 2000, pp. 289-295
Effects of high current conduction in sub-micron Ti-silicided films
Authors:
Gan, CL Pey, KL Chim, WK Siah, SY
Citation:
Cl. Gan et al., Effects of high current conduction in sub-micron Ti-silicided films, SOL ST ELEC, 44(10), 2000, pp. 1837-1845
Formation of voids in Ti-salicided BF2+-doped submicron polysilicon lines
Authors:
Chua, HN Pey, KL Lai, WH Siah, SY
Citation:
Hn. Chua et al., Formation of voids in Ti-salicided BF2+-doped submicron polysilicon lines, J APPL PHYS, 87(12), 2000, pp. 8401-8406
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