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Results: 1-4 |
Results: 4

Authors: Pey, KL Chua, HN Siah, SY
Citation: Kl. Pey et al., Effect of BF2+ implantation on void formation in Ti-salicided narrow polysilicon lines, EL SOLID ST, 3(9), 2000, pp. 442-445

Authors: Pey, KL Sundaresan, R Wong, H Siah, SY Tung, CH
Citation: Kl. Pey et al., Void formation in titanium desilicide/p(+) silicon interface: impact on junction leakage and silicide sheet resistance, MAT SCI E B, 74(1-3), 2000, pp. 289-295

Authors: Gan, CL Pey, KL Chim, WK Siah, SY
Citation: Cl. Gan et al., Effects of high current conduction in sub-micron Ti-silicided films, SOL ST ELEC, 44(10), 2000, pp. 1837-1845

Authors: Chua, HN Pey, KL Lai, WH Siah, SY
Citation: Hn. Chua et al., Formation of voids in Ti-salicided BF2+-doped submicron polysilicon lines, J APPL PHYS, 87(12), 2000, pp. 8401-8406
Risultati: 1-4 |