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Results:
1-14
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Results: 14
Authors:
Dick, B
Brett, MJ
Smy, T
Belov, M
Freeman, MR
Citation: B. Dick et al., Periodic submicrometer structures by sputtering, J VAC SCI B, 19(5), 2001, pp. 1813-1819
Authors:
Smy, T
Dew, SK
Joshi, RV
Citation: T. Smy et al., Efficient modeling of thin film deposition for low sticking using a three-dimensional microstructural simulator, J VAC SCI A, 19(1), 2001, pp. 251-261
Authors:
Smy, T
Walkey, D
Dew, SK
Citation: T. Smy et al., A 3-D thermal simulation tool for integrated devices - Atar, IEEE COMP A, 20(1), 2001, pp. 105-115
Authors:
Harris, KD
Vick, D
Gonzalez, EJ
Smy, T
Robbie, K
Brett, MJ
Citation: Kd. Harris et al., Porous thin films for thermal barrier coatings, SURF COAT, 138(2-3), 2001, pp. 185-191
Authors:
Smy, T
Walkey, D
Harris, KD
Brett, MJ
Citation: T. Smy et al., Thin film microstructure and thermal transport simulation using 3D-films, THIN SOL FI, 391(1), 2001, pp. 88-100
Authors:
Smy, T
Walkey, D
Dew, SK
Citation: T. Smy et al., Transient 3D heat flow analysis for integrated circuit devices using the transmission line matrix method on a quad tree mesh, SOL ST ELEC, 45(7), 2001, pp. 1137-1148
Authors:
Reimer, CJ
Smy, T
Walkey, DJ
Beggs, BC
Surridge, R
Citation: Cj. Reimer et al., A simulation study of IC layout effects on thermal management of die attached GaAsICs, IEEE T COMP, 23(2), 2000, pp. 341-351
Authors:
Li, M
Dew, S
Brett, M
Smy, T
Citation: M. Li et al., Kinetic simulation of metal chemical-vapor deposition on high aspect ratiofeatures in modern very-large-scale-integrated processing, J VAC SCI B, 18(3), 2000, pp. 1343-1347
Authors:
Smy, T
Vick, D
Brett, MJ
Dew, SK
Wu, AT
Sit, JC
Harris, KD
Citation: T. Smy et al., Three-dimensional simulation of film microstructure produced by glancing angle deposition, J VAC SCI A, 18(5), 2000, pp. 2507-2512
Authors:
Friedrich, LJ
Dew, SK
Brett, MJ
Smy, T
Citation: Lj. Friedrich et al., Integrating system and feature scale models to study copper reflow, J VAC SCI B, 17(1), 1999, pp. 186-193
Authors:
Friedrich, LJ
Dew, SK
Brett, MJ
Smy, T
Citation: Lj. Friedrich et al., A simulation study of copper reflow characteristics in vias, IEEE SEMIC, 12(3), 1999, pp. 353-365
Authors:
Vick, D
Friedrich, LJ
Dew, SK
Brett, MJ
Robbie, K
Seto, M
Smy, T
Citation: D. Vick et al., Self-shadowing and surface diffusion effects in obliquely deposited thin films (vol 339, pg 88, 1999), THIN SOL FI, 349(1-2), 1999, pp. 303-303
Authors:
Vick, D
Friedrich, LJ
Dew, SK
Brett, MJ
Robbie, K
Seto, M
Smy, T
Citation: D. Vick et al., Self-shadowing and surface diffusion effects in obliquely deposited thin films, THIN SOL FI, 339(1-2), 1999, pp. 88-94
Authors:
Smy, T
Joshi, RV
Tait, N
Dew, SK
Brett, MJ
Citation: T. Smy et al., An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layers, J APPL PHYS, 84(9), 1998, pp. 5315-5325
Risultati:
1-14
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