Authors: Davitt, E Stam, FA Barrett, J

Citation: E. Davitt et al., The effect of power cycling on the reliability of lead-free surface mount assemblies, IEEE T COMP, 24(2), 2001, pp. 241-249

Authors: Stam, FA Davitt, E

Citation: Fa. Stam et E. Davitt, Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints, MICROEL REL, 41(11), 2001, pp. 1815-1822

Authors: Corbett, B Rodgers, K Stam, FA O'Connell, D Kelly, PV Crean, GM

Citation: B. Corbett et al., Low-stress hybridisation of emitters, detectors and driver circuitry on a silicon motherboard for optoelectronic interconnect architecture, MAT SC S PR, 3(5-6), 2000, pp. 449-453