Citation: Hm. Tong et al., THEORY OF PRESSURE SINTERING OF GLASS-CERAMIC MULTICHIP CARRIERS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 203-214
Authors:
DATTA M
SHENOY RV
JOHNES C
ANDRICACOS PC
HORKANS J
DUKOVIC JO
ROMANKIW LT
ROEDER J
DELIGIANNI H
NYE H
AGARWALA B
TONG HM
TOTTA P
Citation: M. Datta et al., ELECTROCHEMICAL FABRICATION OF MECHANICALLY ROBUST PBSN C4 INTERCONNECTIONS, Journal of the Electrochemical Society, 142(11), 1995, pp. 3779-3785
Authors:
TONG HM
MOK LS
GREBE KR
YEH HL
SRIVASTAVA KK
COFFIN JT
Citation: Hm. Tong et al., EFFECTS OF PARYLENE COATING ON THE THERMAL FATIGUE LIFE OF SOLDER JOINTS IN CERAMIC PACKAGES, IEEE transactions on components, hybrids, and manufacturing technology, 16(5), 1993, pp. 571-576