Authors: TONG HM GOLAND D CHANCE D

Citation: Hm. Tong et al., THEORY OF PRESSURE SINTERING OF GLASS-CERAMIC MULTICHIP CARRIERS, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 19(1), 1996, pp. 203-214

Authors: TONG HM

Citation: Hm. Tong, MICROELECTRONICS PACKAGING - PRESENT AND FUTURE, Materials chemistry and physics, 40(3), 1995, pp. 147-161

Authors: DURNING CJ HASSAN MM TONG HM LEE KW

Citation: Cj. Durning et al., A STUDY OF CASE-II TRANSPORT BY LASER INTERFEROMETRY, Macromolecules, 28(12), 1995, pp. 4234-4248

Authors: DATTA M SHENOY RV JOHNES C ANDRICACOS PC HORKANS J DUKOVIC JO ROMANKIW LT ROEDER J DELIGIANNI H NYE H AGARWALA B TONG HM TOTTA P

Citation: M. Datta et al., ELECTROCHEMICAL FABRICATION OF MECHANICALLY ROBUST PBSN C4 INTERCONNECTIONS, Journal of the Electrochemical Society, 142(11), 1995, pp. 3779-3785

Authors: TONG HM MOK LS GREBE KR YEH HL SRIVASTAVA KK COFFIN JT

Citation: Hm. Tong et al., EFFECTS OF PARYLENE COATING ON THE THERMAL FATIGUE LIFE OF SOLDER JOINTS IN CERAMIC PACKAGES, IEEE transactions on components, hybrids, and manufacturing technology, 16(5), 1993, pp. 571-576

Authors: TONG HM SAENGER KL SU GW

Citation: Hm. Tong et al., THICKNESS-DIRECTION THERMAL-EXPANSION OF POLYIMIDE FILMS, Polymer engineering and science, 33(22), 1993, pp. 1502-1506