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Results: 1-4 |
Results: 4

Authors: Tangyunyong, P Benson, D Cole, EI
Citation: P. Tangyunyong et al., Thermal modeling of a polysilicon-metal test structure used for thermally induced voltage alteration characterization, J VAC SCI B, 18(6), 2000, pp. 2820-2825

Authors: Cole, EI Tangyunyong, P Benson, DA Barton, DL
Citation: Ei. Cole et al., TIVA and SEI developments for enhanced front and backside interconnection failure analysis, MICROEL REL, 39(6-7), 1999, pp. 991-996

Authors: Cole, EI Tangyunyong, P Barton, DL
Citation: Ei. Cole et al., Local thermal probing to detect open and shorted IC interconnections, MICROEL REL, 39(5), 1999, pp. 681-693

Authors: Tanner, DM Miller, WM Peterson, KA Dugger, MT Eaton, WP Irwin, LW Senft, DC Smith, NF Tangyunyong, P Miller, SL
Citation: Dm. Tanner et al., Frequency dependence of the lifetime of a surface micromachined microengine driving a load, MICROEL REL, 39(3), 1999, pp. 401-414
Risultati: 1-4 |