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Authors: Lenosky, TJ Sadigh, B Theiss, SK Caturla, MJ de la Rubia, TD

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Authors: Lau, JT Prybyla, JA Theiss, SK

Citation: Jt. Lau et al., In situ electron microscopy studies of electromigration in stacked Al(Cu)/TiN interconnects, APPL PHYS L, 76(2), 2000, pp. 164-166

Authors: Sadigh, B Lenosky, TJ Theiss, SK Caturla, MJ de la Rubia, TD Foad, MA

Citation: B. Sadigh et al., Mechanism of boron diffusion in silicon: An ab initio and kinetic Monte Carlo study, PHYS REV L, 83(21), 1999, pp. 4341-4344

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Citation: X. Chu et al., Crystallographic study of electromigration failure sites in submicron Al(Cu) interconnects, APPL PHYS L, 75(24), 1999, pp. 3790-3792