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Results: 1-10 |
Results: 10
Using NH3 plasma pretreatment to improve the characteristics of organic spin-on low-k materials for copper metallization
Authors: Chang, KM Tseng, MH Deng, IC Tsai, YP Yeh, SJ
Citation: Km. Chang et al., Using NH3 plasma pretreatment to improve the characteristics of organic spin-on low-k materials for copper metallization, JPN J A P 1, 40(11), 2001, pp. 6663-6667
A detailed study of rough edge crack with worn asperities
Authors: Young, LJ Tsai, YP
Citation: Lj. Young et Yp. Tsai, A detailed study of rough edge crack with worn asperities, INT J SOL S, 37(35), 2000, pp. 4783-4790
A novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistance
Authors: Chang, KM Deng, IC Tsai, YP Wen, CY Yeh, SJ Wang, SW Wang, JY
Citation: Km. Chang et al., A novel pretreatment technology for organic low-dielectric material to suppress copper diffusion and improve ashing resistance, J ELCHEM SO, 147(6), 2000, pp. 2332-2336
Using NH3 plasma treatment to improve the characteristics of hydrogen silsesquioxane for copper interconnection application
Authors: Chang, KM Deng, IC Yeh, SJ Tsai, YP
Citation: Km. Chang et al., Using NH3 plasma treatment to improve the characteristics of hydrogen silsesquioxane for copper interconnection application, J ELCHEM SO, 147(5), 2000, pp. 1957-1961
Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method
Authors: Zheng, DW Xu, YH Tsai, YP Tu, KN Patterson, P Zhao, B Liu, QZ Brongo, M
Citation: Dw. Zheng et al., Mechanical property measurement of thin polymeric-low dielectric-constant films using bulge testing method, APPL PHYS L, 76(15), 2000, pp. 2008-2010
Suppression of copper diffusion through barrier metal-free hydrogen silsesquioxane dielectrics by NH3 plasma treatment
Authors: Chang, KM Deng, IC Yeh, SJ Tsai, YP
Citation: Km. Chang et al., Suppression of copper diffusion through barrier metal-free hydrogen silsesquioxane dielectrics by NH3 plasma treatment, EL SOLID ST, 2(12), 1999, pp. 634-636
Effect of processing parameters on the microstructure and mechanical properties of TiN film on stainless steel by HCD ion plating
Authors: Huang, JH Tsai, YP Yu, GP
Citation: Jh. Huang et al., Effect of processing parameters on the microstructure and mechanical properties of TiN film on stainless steel by HCD ion plating, THIN SOL FI, 356, 1999, pp. 440-445
A boundary element application for mixed mode loading idealized sawtooth fracture surface
Authors: Young, LJ Tsai, YP
Citation: Lj. Young et Yp. Tsai, A boundary element application for mixed mode loading idealized sawtooth fracture surface, INT J SOL S, 36(21), 1999, pp. 3239-3252
Effects of leading-wall blowing/suction on mixed convective phenomena in aradially rotating multiple-pass duct
Authors: Hwang, JJ Tsai, YP Wang, WJ Lai, DY
Citation: Jj. Hwang et al., Effects of leading-wall blowing/suction on mixed convective phenomena in aradially rotating multiple-pass duct, INT J HEAT, 42(24), 1999, pp. 4461-4474
Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant
Authors: Xu, YH Tsai, YP Tu, KN Zhao, B Liu, QZ Brongo, M Sheng, GTT Tung, CH
Citation: Yh. Xu et al., Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant, APPL PHYS L, 75(6), 1999, pp. 853-855
Risultati: 1-10 |