Citation: Ep. Vandamme et al., Impact of probe-to-pad contact degradation on the high frequency characteristics of RF MOSFETs and guidelines to avoid it, INT J RF MI, 11(3), 2001, pp. 114-120
Authors:
Vandamme, EP
Schreurs, DMMP
van Dinther, G
Citation: Ep. Vandamme et al., Improved three-step de-embedding method to accurately account for the influence of pad parasitics in silicon on-wafer RF test-structures, IEEE DEVICE, 48(4), 2001, pp. 737-742
Citation: Ep. Vandamme et Lkj. Vandamme, Current crowding and its effect on 1/f noise and third harmonic distortion- a case study for quality assessment of resistors, MICROEL REL, 40(11), 2000, pp. 1847-1853
Authors:
Augendre, E
Rooyackers, R
Caymax, M
Vandamme, EP
De Keersgieter, A
Perello, C
Van Dievel, M
Pochet, S
Badenes, G
Citation: E. Augendre et al., Elevated source/drain by sacrificial selective epitaxy for high performance deep submicron CMOS: Process window versus complexity, IEEE DEVICE, 47(7), 2000, pp. 1484-1491