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Results:
1-7
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Results: 7
Authors:
WU X
DOU X
YEH CP
WAYTT K
Citation: X. Wu et al., SOLDER JOINT FORMATION SIMULATION AND COMPONENT TOMBSTONING PREDICTION DURING REFLOW, Journal of electronic packaging, 120(2), 1998, pp. 141-144
Authors:
HU KX
YEH CP
WYATT KW
Citation: Kx. Hu et al., ELECTRO-THERMO-MECHANICAL RESPONSES OF CONDUCTIVE ADHESIVE MATERIALS, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 470-477
Authors:
HU KX
YEH CP
WU XS
WYATT K
Citation: Kx. Hu et al., AN INTERFACIAL DELAMINATION ANALYSIS FOR MULTICHIP-MODULE THIN-FILM INTERCONNECTS, Journal of electronic packaging, 118(4), 1996, pp. 206-213
Authors:
HUANG Y
HU KX
YEH CP
LI NY
HWANG KC
Citation: Y. Huang et al., A MODEL STUDY OF THERMAL STRESS-INDUCED VOIDING IN ELECTRONIC PACKAGES, Journal of electronic packaging, 118(4), 1996, pp. 229-234
Authors:
HU KX
HUANG Y
YEH CP
WYATT KW
Citation: Kx. Hu et al., STRESS-ANALYSIS OF PRINTED-CIRCUIT BOARDS WITH HIGHLY POPULATED SOLDER JOINTS AND COMPONENTS - A MICROMECHANICS APPROACH, Journal of electronic packaging, 118(2), 1996, pp. 87-93
Authors:
LUI PW
TSEN LY
FU MJ
YEH CP
LEE TY
CHAN SHH
Citation: Pw. Lui et al., INHIBITION BY INTRATHECAL PRAZOSIN BUT NOT YOHIMBINE OF FENTANYL-INDUCED MUSCULAR RIGIDITY IN THE RAT, Neuroscience letters, 201(2), 1995, pp. 167-170
Authors:
YEH CP
UME C
FULTON RE
WYATT KW
STAFFORD JW
Citation: Cp. Yeh et al., CORRELATION OF ANALYTICAL AND EXPERIMENTAL APPROACHES TO DETERMINE THERMALLY-INDUCED PWB WARPAGE, IEEE transactions on components, hybrids, and manufacturing technology, 16(8), 1993, pp. 986-995
Risultati:
1-7
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