Authors: WANG JJ LU MF ZOU DQ LIU S

Citation: Jj. Wang et al., INVESTIGATION OF INTERFACIAL FRACTURE-BEHAVIOR OF A FLIP-CHIP PACKAGEUNDER A CONSTANT CONCENTRATED LOAD, IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 21(1), 1998, pp. 79-86

Authors: XIE HM WANG GT ZOU DQ DAI FL DIETZ P WEI Z SCHMIDT A

Citation: Hm. Xie et al., EXPERIMENTAL-STUDY ON THE DAMAGE PROGRESSION OF AN ALUMINUM PLATE IRRADIATED BY CO2-LASER, Journal of materials processing technology, 82(1-3), 1998, pp. 137-144

Authors: HE XY ZOU DQ LIU S

Citation: Xy. He et al., PHASE-SHIFTING ANALYSIS IN MOIRE INTERFEROMETRY AND ITS APPLICATIONS IN ELECTRONIC PACKAGING, Optical engineering, 37(5), 1998, pp. 1410-1419

Authors: LIU S ZHU JS ZOU DQ BENSON J

Citation: S. Liu et al., STUDY OF DELAMINATED PLASTIC PACKAGES BY HIGH-TEMPERATURE MOIRE AND FINITE-ELEMENT METHOD, IEEE transactions on components, packaging, and manufacturing technology. Part A, 20(4), 1997, pp. 505-512

Authors: DING ZY ZOU DQ DING HJ

Citation: Zy. Ding et al., A STUDY OF EFFECTS OF THE EARTHS RADIAL ANISOTROPY ON THE TIDAL STRESS-FIELD, Tectonophysics, 258(1-4), 1996, pp. 103-114