Gq. Lu et al., CONTAMINATION CONTROL FOR GAS DELIVERY FROM A LIQUID SOURCE IN SEMICONDUCTOR MANUFACTURING, IEEE transactions on semiconductor manufacturing, 10(4), 1997, pp. 425-432
Gas delivery from a liquid source, common in semiconductor manufacturi
ng, raises contamination control concerns not only due to impurity lev
els in the source. In addition, the lower vapor pressure of impurity s
pecies compared to that of the host (source) species causes impurity c
oncentrations in delivered gas to increase as the source is used up, A
physics-based dynamic simulator to describe the time-dependent variat
ion of impurity level in such a gas delivery system has been developed
and applied to the important case of CHCIF2 impurities in host CHF3 l
iquid, as routinely used for dry etching processes, For a cylinder of
CHF3 liquid with 100 ppm of CHClF2 at 21.1 degrees C (70 degrees F), t
he concentration of CHClF2 in the delivered gas is initially similar t
o 21 ppm, and rises slowly to similar to 100 ppm with similar to 25% o
f the initial material remaining, With further usage, the CHCIF2 level
increases quickly to similar to 350 ppm when similar to 15% of the in
itial source material is left; at this point, the source has reached t
he liquid-dry point, i.e., all the remaining source material is gaseou
s, and the impurity concentration in delivered gas remains constant at
350 ppm until all material is gone. The time-dependence of CHClF2 imp
urity concentration is also dependent on the operating temperature of
the liquid source: for higher temperatures, the fast rise in impurity
concentration and the liquid-dry point occur earlier, while the final
impurity level after this point is lower, The dynamic simulator repres
ents a useful tool for avoiding contamination problems with liquid del
ivery systems and for optimizing materials usage (for cost and environ
mental benefits) by structuring source usage procedures consistent wit
h contamination-sensitivity of the process. The results also suggest b
enefits in materials usage if specific source temperatures (different
from room temperature) were imposed. The physical basis of the dynamic
simulator allows more general application to other systems.