ANALYSES OF THERMAL-STRESSES AND CONTROL SCHEMES FOR FAST TEMPERATURERAMPS OF BATCH FURNACES

Authors
Citation
Yh. Fan et Tq. Qiu, ANALYSES OF THERMAL-STRESSES AND CONTROL SCHEMES FOR FAST TEMPERATURERAMPS OF BATCH FURNACES, IEEE transactions on semiconductor manufacturing, 10(4), 1997, pp. 433-437
Citations number
28
Categorie Soggetti
Engineering, Eletrical & Electronic","Engineering, Manufacturing","Physics, Applied
ISSN journal
08946507
Volume
10
Issue
4
Year of publication
1997
Pages
433 - 437
Database
ISI
SICI code
0894-6507(1997)10:4<433:AOTACS>2.0.ZU;2-5
Abstract
This work studies fast temperature ramps of batch furnaces under diffe rent control schemes based on thermal and stress analyses, ri thermal model is first developed to predict temperature distributions on silic on wafers during ramping processes. Thermoelastic model of stresses is then used to predict the onset of slip-line generation under dynamic conditions, Three control schemes, one based on a maximum allowable wi thin-wafer temperature difference, one with a constant cooling rate, a nd the third based on the condition for onset of slip generation, are then analyzed. The results show that in order to achieve the highest r amp rates while maintaining defect-free wafer processing, the ultimate criterion for temperature control of the furnaces should be the condi tion for the onset of defect generation instead of the conventional sc heme based on constant ramp rates.