Yh. Fan et Tq. Qiu, ANALYSES OF THERMAL-STRESSES AND CONTROL SCHEMES FOR FAST TEMPERATURERAMPS OF BATCH FURNACES, IEEE transactions on semiconductor manufacturing, 10(4), 1997, pp. 433-437
This work studies fast temperature ramps of batch furnaces under diffe
rent control schemes based on thermal and stress analyses, ri thermal
model is first developed to predict temperature distributions on silic
on wafers during ramping processes. Thermoelastic model of stresses is
then used to predict the onset of slip-line generation under dynamic
conditions, Three control schemes, one based on a maximum allowable wi
thin-wafer temperature difference, one with a constant cooling rate, a
nd the third based on the condition for onset of slip generation, are
then analyzed. The results show that in order to achieve the highest r
amp rates while maintaining defect-free wafer processing, the ultimate
criterion for temperature control of the furnaces should be the condi
tion for the onset of defect generation instead of the conventional sc
heme based on constant ramp rates.