ANALYSIS OF DRYING SHRINKAGE AND FLOW DUE TO SURFACE-TENSION OF SPIN-COATED FILMS ON TOPOGRAPHIC SUBSTRATES

In semiconductor manufacturing processes, it is important that the SiO 2 isolation films around aluminum connection lines have Bat surfaces i n order to produce the multilayered connection lines used in high-dens ity devices. In this paper, we analyzed transient changes, in the thic kness distributions of a liquid-SOG (Spin-on-Glass) film on a two-dime nsionally (2-D) grooved substrate during the evaporative shrinking pro cess. The Bow due Co surface tension of the shrinking liquid film was calculated, Since the film is thin, a boundary layer approximation cou ld be applied, and fourth-order differential equations of film thickne ss were solved using an iteration method. The viscosity and the shrink age rate were assumed to he functions of the concentration of the solv ent in the film, When the parameter of ratio [(surface tension)/{(visc osity) x (shrinking speed)}] is large and the width of the grooves is small, final surface undulations of the film are shallow, The effect o f the centrifugal force was also analyzed.