Dp. Connors et Dd. Yao, METHODS FOR JOB CONFIGURATION IN SEMICONDUCTOR MANUFACTURING, IEEE transactions on semiconductor manufacturing, 9(3), 1996, pp. 401-411
Job configuration in semiconductor manufacturing refers to the process
of configuring silicon wafers in terms of chip types and volumes, org
anizing collections of wafers into jobs, and determining the volume of
jobs to be released into the production line, The difficulties of job
configuration lie in the random yield loss, the numerous technologica
l constraints, and the rigid set serviceability, requirement (i.e., de
mand must be met in terms of all chip types), Motivated by the configu
ration problems in the ''early-user hardware'' development programs at
some IBM plants, we develop here a systematic approach to job configu
ration, The centerpiece of the approach is a careful treatment of the
set serviceability constraint, in terms of both probability and expect
ation, It solves the job configuration problem as separable convex pro
grams using marginal allocation algorithms, Through numerical examples
, we demonstrate that by allowing diversity of chip tyes at either the
job- or the wafer-level, higher serviceability can be achieved using
fewer wafers.