FUZZY-LOGIC MODELS FOR THERMALLY BASED MICROELECTRONIC MANUFACTURING PROCESSES

This paper presents fuzzy logic models (FLM) to simulate two thermally based microelectronic manufacturing processes: the (pool boiling'' in vapor phase soldering and silicon deposition process in a horizontal chemical vapor deposition (CVD) reactor, After a brief discussion of t he various input-output models, we present our general approach to the development of FLM's, followed by their application to the two case s tudies, For the pool boiling, experimental data are used to develop th e fuzzy logic model, Results show that the FLM not only simulates the different regions of the pool boiling curve satisfactorily, but also f aithfully represents the two transitions, For the CVD process, pseudo- analytical equations from Eversteyn's paper are used to generate data under simulated production conditions, Results show that the model can describe the process very well, The physico-fuzzy model, incorporatin g the physical understanding of the process, is shown to improve the m odel's extrapolation capability.