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Results:
1-18
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Results: 18
Authors:
Hocheng, H
Tsai, HY
Huang, YL
Citation: H. Hocheng et al., Essential aspects of chemical mechanical planarization for oxide semiconductor, KEY ENG MAT, 196, 2001, pp. 1-24
Authors:
Watanabe, J
Etoh, R
Hirano, M
Citation: J. Watanabe et al., A novel chemical-mechanical planarization technology using pre-thin-surface grinding in ULSI manufacturing process, KEY ENG MAT, 196, 2001, pp. 25-30
Authors:
Cheong, WCD
Zhang, LC
Tanaka, H
Citation: Wcd. Cheong et al., Some essentials of simulating nano-surfacing processes using the moleculardynamics method, KEY ENG MAT, 196, 2001, pp. 31-41
Authors:
Zhang, HJ
Chen, WY
Chen, DC
Zhang, LC
Citation: Hj. Zhang et al., Assessment of the exit defects in carbon fibre-reinforced plastic plates caused by drilling, KEY ENG MAT, 196, 2001, pp. 43-52
Authors:
Liu, TS
Latella, BA
Zhang, LC
Citation: Ts. Liu et al., Grinding of ceramics: Strength, surface features and grinding conditions, KEY ENG MAT, 196, 2001, pp. 53-60
Authors:
Chen, M
Sun, FH
Xue, BY
Citation: M. Chen et al., Grinding burn mechanism of directionally solidified superalloy, KEY ENG MAT, 196, 2001, pp. 61-68
Authors:
Tanaka, H
Shimada, S
Ikawa, N
Yoshinaga, M
Citation: H. Tanaka et al., Wear mechanism of diamond cutting tool in machining of steel, KEY ENG MAT, 196, 2001, pp. 69-78
Authors:
Maekawa, K
Kubo, A
Childs, THC
Citation: K. Maekawa et al., A friction model for free-machining steels and its applicability to machinability analysis, KEY ENG MAT, 196, 2001, pp. 79-90
Authors:
Kato, T
Ohmori, H
Zhang, C
Yamazaki, T
Akune, Y
Hokkirigawa, K
Citation: T. Kato et al., Improvement of friction and wear properties of CVD-SiC firms with new surface finishing method 'ELID-grinding', KEY ENG MAT, 196, 2001, pp. 91-101
Authors:
Kuriyagawa, T
Sakuyama, T
Syoji, K
Onodera, H
Citation: T. Kuriyagawa et al., A new device of abrasive jet machining and application to abrasive jet printer, KEY ENG MAT, 196, 2001, pp. 103-110
Authors:
Shimizu, S
Sakamoto, H
Citation: S. Shimizu et H. Sakamoto, On-machine monitoring of the wheel-working surface condition with the relative frequency distribution of its profile, KEY ENG MAT, 196, 2001, pp. 111-120
Authors:
Sakamoto, H
Shimizu, S
Citation: H. Sakamoto et S. Shimizu, On-machine monitoring of the wheel working surface condition with the fractal dimension analysis of its profile, KEY ENG MAT, 196, 2001, pp. 121-131
Authors:
Maekawa, K
Yokoyama, Y
Ohshima, I
Citation: K. Maekawa et al., Fabrication of metal-bonded grinding/polishing tools by greentape laser sintering method, KEY ENG MAT, 196, 2001, pp. 133-140
Authors:
Andersson, J
Hollman, P
Jacobson, S
Citation: J. Andersson et al., Abrasive capacity of thin film diamond structures, KEY ENG MAT, 196, 2001, pp. 141-148
Authors:
Yang, CT
Ho, SS
Yan, BH
Citation: Ct. Yang et al., Micro hole machining of borosilicate glass through electrochemical discharge machining (ECDM), KEY ENG MAT, 196, 2001, pp. 149-166
Authors:
Matsuzawa, T
Ohmori, H
Zhang, C
Li, W
Yamagata, Y
Moriyasu, S
Makinouchi, A
Citation: T. Matsuzawa et al., Micro-spherical lens mold fabrication by cup-type metal-bond grinding wheels applying ELID (electrolytic in-process dressing), KEY ENG MAT, 196, 2001, pp. 167-175
Authors:
Ezugwu, EO
Okeke, CI
Citation: Eo. Ezugwu et Ci. Okeke, Threading of inclusion modified steels with coated carbide tools, KEY ENG MAT, 196, 2001, pp. 177-192
Authors:
Chen, M
Sun, FH
Zhang, ZM
Citation: M. Chen et al., CVD diamond coating technologies and application in cutting abrasive materials, KEY ENG MAT, 196, 2001, pp. 193-198
Risultati:
1-18
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