AAAAAA

   
Results: 1-19 |
Results: 19
SILICON MICROPHONES - A DANISH PERSPECTIVE
Authors: BOUWSTRA S STORGAARDLARSEN T SCHEEPER P GULLOV JO BAY J MULLENBORG M ROMBACH P
Citation: S. Bouwstra et al., SILICON MICROPHONES - A DANISH PERSPECTIVE, Journal of micromechanics and microengineering, 8(2), 1998, pp. 64-68
CONFORMAL COATING BY PHOTORESIST OF SHARP CORNERS OF ANISOTROPICALLY ETCHED THROUGH-HOLES IN SILICON
Authors: HESCHEL M BOUWSTRA S
Citation: M. Heschel et S. Bouwstra, CONFORMAL COATING BY PHOTORESIST OF SHARP CORNERS OF ANISOTROPICALLY ETCHED THROUGH-HOLES IN SILICON, Sensors and actuators. A, Physical, 70(1-2), 1998, pp. 75-80
RELIABILITY OF INDUSTRIAL PACKAGING FOR MICROSYSTEMS
Authors: DEREUS R CHRISTENSEN C WEICHEL S BOUWSTRA S JANTING J ERIKSEN GF DYRBYE K BROWN TR KROG JP JENSEN OS GRAVESEN P
Citation: R. Dereus et al., RELIABILITY OF INDUSTRIAL PACKAGING FOR MICROSYSTEMS, Microelectronics and reliability, 38(6-8), 1998, pp. 1251-1260
DESIGN AND FABRICATION OF COMPLIANT MICROMECHANISMS AND STRUCTURES WITH NEGATIVE POISSONS RATIO
Authors: LARSEN UD SIGMUND O BOUWSTRA S
Citation: Ud. Larsen et al., DESIGN AND FABRICATION OF COMPLIANT MICROMECHANISMS AND STRUCTURES WITH NEGATIVE POISSONS RATIO, Journal of microelectromechanical systems, 6(2), 1997, pp. 99-106
FABRICATION AND CHARACTERIZATION OF TRULY 3-D DIFFUSER NOZZLE MICROSTRUCTURES IN SILICON/
Authors: HESCHEL M MULLENBORN M BOUWSTRA S
Citation: M. Heschel et al., FABRICATION AND CHARACTERIZATION OF TRULY 3-D DIFFUSER NOZZLE MICROSTRUCTURES IN SILICON/, Journal of microelectromechanical systems, 6(1), 1997, pp. 41-47
LASER DIRECT WRITING ON STRUCTURED SUBSTRATES
Authors: MULLENBORN M GREY F BOUWSTRA S
Citation: M. Mullenborn et al., LASER DIRECT WRITING ON STRUCTURED SUBSTRATES, Journal of micromechanics and microengineering, 7(3), 1997, pp. 125-127
WAFER THROUGH-HOLE INTERCONNECTIONS WITH HIGH VERTICAL WIRING DENSITIES
Authors: CHRISTENSEN C KERSTEN P HENKE S BOUWSTRA S
Citation: C. Christensen et al., WAFER THROUGH-HOLE INTERCONNECTIONS WITH HIGH VERTICAL WIRING DENSITIES, IEEE transactions on components, packaging, and manufacturing technology. Part A, 19(4), 1996, pp. 516-522
LASER DIRECT ETCHING OF SILICON ON OXIDE FOR RAPID PROTOTYPING
Authors: MULLENBORN M HESCHEL M LARSEN UD DIRAC H BOUWSTRA S
Citation: M. Mullenborn et al., LASER DIRECT ETCHING OF SILICON ON OXIDE FOR RAPID PROTOTYPING, Journal of micromechanics and microengineering, 6(1), 1996, pp. 49-51
AFM PROBES WITH DIRECTLY FABRICATED TIPS
Authors: BOISEN A HANSEN O BOUWSTRA S
Citation: A. Boisen et al., AFM PROBES WITH DIRECTLY FABRICATED TIPS, Journal of micromechanics and microengineering, 6(1), 1996, pp. 58-62
IMPROVED QUALITY OF ZINC-OXIDE THIN-FILMS BY IN-SITU ANNEALING
Authors: BAKMIKKELSEN E DEREUS R BOUWSTRA S
Citation: E. Bakmikkelsen et al., IMPROVED QUALITY OF ZINC-OXIDE THIN-FILMS BY IN-SITU ANNEALING, Journal of micromechanics and microengineering, 6(1), 1996, pp. 63-65
DESIGN OF A SILICON MICROPHONE WITH DIFFERENTIAL READ-OUT OF A SEALEDDOUBLE PARALLEL-PLATE CAPACITOR
Authors: BAY J HANSEN O BOUWSTRA S
Citation: J. Bay et al., DESIGN OF A SILICON MICROPHONE WITH DIFFERENTIAL READ-OUT OF A SEALEDDOUBLE PARALLEL-PLATE CAPACITOR, Sensors and actuators. A, Physical, 53(1-3), 1996, pp. 232-236
OPTOMECHANICAL ACCELEROMETER BASED ON STRAIN SENSING BY A BRAGG GRATING IN A PLANAR WAVE-GUIDE
Authors: STORGAARDLARSEN T BOUWSTRA S LEISTIKO O
Citation: T. Storgaardlarsen et al., OPTOMECHANICAL ACCELEROMETER BASED ON STRAIN SENSING BY A BRAGG GRATING IN A PLANAR WAVE-GUIDE, Sensors and actuators. A, Physical, 52(1-3), 1996, pp. 25-32
FAST 3-DIMENSIONAL LASER MICROMACHINING OF SILICON FOR MICROSYSTEMS
Authors: MULLENBORN M DIRAC H PETERSEN JW BOUWSTRA S
Citation: M. Mullenborn et al., FAST 3-DIMENSIONAL LASER MICROMACHINING OF SILICON FOR MICROSYSTEMS, Sensors and actuators. A, Physical, 52(1-3), 1996, pp. 121-125
INDIRECT TIP FABRICATION FOR SCANNING PROBE MICROSCOPY
Authors: BOISEN A RASMUSSEN JP HANSEN O BOUWSTRA S
Citation: A. Boisen et al., INDIRECT TIP FABRICATION FOR SCANNING PROBE MICROSCOPY, Microelectronic engineering, 30(1-4), 1996, pp. 579-582
MICROMACHINED AFM TRANSDUCER WITH DIFFERENTIAL CAPACITIVE READ-OUT
Authors: BAY J BOUWSTRA S LAEGSGAARD E HANSEN O
Citation: J. Bay et al., MICROMACHINED AFM TRANSDUCER WITH DIFFERENTIAL CAPACITIVE READ-OUT, Journal of micromechanics and microengineering, 5(2), 1995, pp. 161-165
PHOTOLITHOGRAPHY ON MICROMACHINED 3D SURFACES USING ELECTRODEPOSITED PHOTORESISTS
Authors: KERSTEN P BOUWSTRA S PETERSEN JW
Citation: P. Kersten et al., PHOTOLITHOGRAPHY ON MICROMACHINED 3D SURFACES USING ELECTRODEPOSITED PHOTORESISTS, Sensors and actuators. A, Physical, 51(1), 1995, pp. 51-54
ON-CHIP DECOUPLING ZONE FOR PACKAGE-STRESS REDUCTION
Authors: SPIERING VL BOUWSTRA S SPIERING RMEJ
Citation: Vl. Spiering et al., ON-CHIP DECOUPLING ZONE FOR PACKAGE-STRESS REDUCTION, Sensors and actuators. A, Physical, 39(2), 1993, pp. 149-156
THERMAL BASE DRIVE FOR MICROMECHANICAL RESONATORS EMPLOYING DEEP-DIFFUSION BASES
Authors: BOUWSTRA S VANROOIJEN J TILMANS HAC SELVAKUMAR A NAJAFI K
Citation: S. Bouwstra et al., THERMAL BASE DRIVE FOR MICROMECHANICAL RESONATORS EMPLOYING DEEP-DIFFUSION BASES, Sensors and actuators. A, Physical, 37-8, 1993, pp. 38-44
REALIZATION OF MECHANICAL DECOUPLING ZONES FOR PACKAGE-STRESS REDUCTION
Authors: SPIERING VL BOUWSTRA S FLUITMAN JHJ
Citation: Vl. Spiering et al., REALIZATION OF MECHANICAL DECOUPLING ZONES FOR PACKAGE-STRESS REDUCTION, Sensors and actuators. A, Physical, 37-8, 1993, pp. 800-804
Risultati: 1-19 |