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Results:
1-9
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Results: 9
Authors:
BUCHWALTER LP
HOLLOWAY K
Citation: Lp. Buchwalter et K. Holloway, TANTALUM, TANTALUM NITRIDE, AND CHROMIUM ADHESION TO POLYIMIDE - EFFECT OF ANNEALING AMBIENT ON ADHESION, Journal of adhesion science and technology, 12(1), 1998, pp. 95-104
Authors:
ZHMURKIN DV
GROSS TS
BUCHWALTER LP
Citation: Dv. Zhmurkin et al., INTERFACIAL SLIDING IN CU TA/POLYIMIDE HIGH-DENSITY INTERCONNECTS AS A RESULT OF THERMAL CYCLING/, Journal of electronic materials, 26(7), 1997, pp. 791-797
Authors:
AFZALI A
BUCHWALTER SL
BUCHWALTER LP
HOUGHAM G
Citation: A. Afzali et al., REACTION OF POLYANILINE WITH NMP AT ELEVATED-TEMPERATURES, Polymer, 38(17), 1997, pp. 4439-4443
Authors:
BUCHWALTER LP
Citation: Lp. Buchwalter, XPS ANALYSIS OF FLUORINATED POLYIMIDES, Journal of adhesion science and technology, 10(11), 1996, pp. 1141-1152
Authors:
BUCHWALTER LP
Citation: Lp. Buchwalter, CHROMIUM AND TANTALUM ADHESION TO PLASMA-DEPOSITED SILICON DIOXIDE AND SILICON-NITRIDE, Journal of adhesion science and technology, 9(1), 1995, pp. 97-116
Authors:
HARPER JME
COLGAN EG
HU CK
HUMMEL JP
BUCHWALTER LP
UZOH CE
Citation: Jme. Harper et al., MATERIALS ISSUES IN COPPER INTERCONNECTIONS, MRS bulletin, 19(8), 1994, pp. 23-29
Authors:
BUCHWALTER LP
SARAF R
Citation: Lp. Buchwalter et R. Saraf, TANTALUM AND CHROMIUM ADHESION TO POLYIMIDE .1. BPDA-PDA SURFACE IMIDIZATION AND MODIFICATION, Journal of adhesion science and technology, 7(9), 1993, pp. 925-940
Authors:
BUCHWALTER LP
Citation: Lp. Buchwalter, TANTALUM AND CHROMIUM ADHESION TO POLYIMIDE .2. PEEL AND LOCUS OF FAILURE ANALYSES, Journal of adhesion science and technology, 7(9), 1993, pp. 941-952
Authors:
LACOMBE RH
BUCHWALTER LP
HOLLOWAY K
Citation: Rh. Lacombe et al., COMPARISON OF FINITE-ELEMENT STRESS-ANALYSIS RESULTS WITH PEEL STRENGTH AT THE COPPER-POLYIMIDE INTERFACE, Journal of adhesion science and technology, 7(12), 1993, pp. 1293-1307
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1-9
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