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Results: 1-14 |
Results: 14
RUN BY RUN ADVANCED PROCESS-CONTROL OF METAL SPUTTER-DEPOSITION
Authors: SMITH TH BONING DS STEFANI J BUTLER SW
Citation: Th. Smith et al., RUN BY RUN ADVANCED PROCESS-CONTROL OF METAL SPUTTER-DEPOSITION, IEEE transactions on semiconductor manufacturing, 11(2), 1998, pp. 276-284
END-POINT PREDICTION FOR POLYSILICON PLASMA ETCH VIA OPTICAL-EMISSIONINTERFEROMETRY
Authors: WONG K BONING DS SAWIN HH BUTLER SW SACHS EM
Citation: K. Wong et al., END-POINT PREDICTION FOR POLYSILICON PLASMA ETCH VIA OPTICAL-EMISSIONINTERFEROMETRY, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 15(3), 1997, pp. 1403-1408
IMMUNOLOGICAL EVIDENCE FOR THE PRESENCE OF ADVANCED GLYCOSYLATION END-PRODUCTS IN ATHEROSCLEROTIC LESIONS OF EUGLYCEMIC RABBITS
Authors: PALINSKI W KOSCHINSKY T BUTLER SW MILLER E VLASSARA H CERAMI A WITZTUM JL
Citation: W. Palinski et al., IMMUNOLOGICAL EVIDENCE FOR THE PRESENCE OF ADVANCED GLYCOSYLATION END-PRODUCTS IN ATHEROSCLEROTIC LESIONS OF EUGLYCEMIC RABBITS, Arteriosclerosis, thrombosis, and vascular biology, 15(5), 1995, pp. 571-582
PROCESS-CONTROL IN SEMICONDUCTOR MANUFACTURING
Authors: BUTLER SW
Citation: Sw. Butler, PROCESS-CONTROL IN SEMICONDUCTOR MANUFACTURING, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 13(4), 1995, pp. 1917-1923
MODELING AND CONTROL OF MICROELECTRONICS MATERIALS PROCESSING
Authors: BADGWELL TA BREEDIJK T BUSHMAN SG BUTLER SW CHATTERJEE S EDGAR TF TOPRAC AJ TRACHTENBERG I
Citation: Ta. Badgwell et al., MODELING AND CONTROL OF MICROELECTRONICS MATERIALS PROCESSING, Computers & chemical engineering, 19(1), 1995, pp. 1-41
1ST-WAFER EFFECT IN REMOTE PLASMA PROCESSING - THE STRIPPING OF PHOTORESIST, SILICON-NITRIDE, AND POLYSILICON
Authors: LOEWENSTEIN LM STEFANI JA BUTLER SW
Citation: Lm. Loewenstein et al., 1ST-WAFER EFFECT IN REMOTE PLASMA PROCESSING - THE STRIPPING OF PHOTORESIST, SILICON-NITRIDE, AND POLYSILICON, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 12(4), 1994, pp. 2810-2817
SENSOR INTEGRATION INTO PLASMA ETCH REACTORS OF A DEVELOPMENTAL PILOTLINE
Authors: BARNA GG LOEWENSTEIN LM BRANKNER KJ BUTLER SW MOZUMDER PK STEFANI JA HENCK SA CHAPADOS P BUCK D MAUNG S SAXENA S UNRUH A
Citation: Gg. Barna et al., SENSOR INTEGRATION INTO PLASMA ETCH REACTORS OF A DEVELOPMENTAL PILOTLINE, Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena, 12(4), 1994, pp. 2860-2867
RABBIT AND HUMAN ATHEROSCLEROTIC LESIONS CONTAIN IGG THAT RECOGNIZES EPITOPES OF OXIDIZED LDL
Authors: YLAHERTTUALA S PALINSKI W BUTLER SW PICARD S STEINBERG D WITZTUM JL
Citation: S. Ylaherttuala et al., RABBIT AND HUMAN ATHEROSCLEROTIC LESIONS CONTAIN IGG THAT RECOGNIZES EPITOPES OF OXIDIZED LDL, Arteriosclerosis and thrombosis, 14(1), 1994, pp. 32-40
A CONTROL-TO-TARGET ARCHITECTURE FOR PROCESS-CONTROL
Authors: SULLIVAN M BUTLER SW HIRSCH J WANG CJ
Citation: M. Sullivan et al., A CONTROL-TO-TARGET ARCHITECTURE FOR PROCESS-CONTROL, IEEE transactions on semiconductor manufacturing, 7(2), 1994, pp. 134-148
INTEGRATION OF IN-SITU SPECTRAL ELLIPSOMETRY WITH MMST MACHINE CONTROL
Authors: MAUNG S BANERJEE S DRAHEIM D HENCK S BUTLER SW
Citation: S. Maung et al., INTEGRATION OF IN-SITU SPECTRAL ELLIPSOMETRY WITH MMST MACHINE CONTROL, IEEE transactions on semiconductor manufacturing, 7(2), 1994, pp. 184-192
SUPERVISORY RUN-TO-RUN CONTROL OF POLYSILICON GATE ETCH USING IN-SITUELLIPSOMETRY
Authors: BUTLER SW STEFANI JA
Citation: Sw. Butler et Ja. Stefani, SUPERVISORY RUN-TO-RUN CONTROL OF POLYSILICON GATE ETCH USING IN-SITUELLIPSOMETRY, IEEE transactions on semiconductor manufacturing, 7(2), 1994, pp. 193-201
INTELLIGENT MODEL-BASED CONTROL-SYSTEM EMPLOYING IN-SITU ELLIPSOMETRY
Authors: BUTLER SW STEFANI J SULLIVAN M MAUNG S BARNA G HENCK S
Citation: Sw. Butler et al., INTELLIGENT MODEL-BASED CONTROL-SYSTEM EMPLOYING IN-SITU ELLIPSOMETRY, Journal of vacuum science & technology. A. Vacuum, surfaces, and films, 12(4), 1994, pp. 1984-1991
DRY ETCH PROCESSES AND SENSORS
Authors: BARNA GG LOEWENSTEIN LM HENCK SA CHAPADOS P BRANKNER KJ GALE RJ MOZUMDER PK BUTLER SW STEFANI JA
Citation: Gg. Barna et al., DRY ETCH PROCESSES AND SENSORS, Solid state technology, 37(1), 1994, pp. 47
ONLINE INFERENCE OF PLASMA ETCH UNIFORMITY USING IN-SITU ELLIPSOMETRY
Authors: STEFANI J BUTLER SW
Citation: J. Stefani et Sw. Butler, ONLINE INFERENCE OF PLASMA ETCH UNIFORMITY USING IN-SITU ELLIPSOMETRY, Journal of the Electrochemical Society, 141(5), 1994, pp. 1387-1391
Risultati: 1-14 |