AAAAAA
Results:
1-15
|
Results: 15
Authors:
Khor, KA
Boey, FYC
Zhao, XL
Cao, LH
Citation: Ka. Khor et al., Aluminium nitride by plasma spraying of an Al2O3-C-Sm2O3 system, MAT SCI E A, 300(1-2), 2001, pp. 203-210
Authors:
Boey, FYC
Yap, BH
Citation: Fyc. Boey et Bh. Yap, Microwave curing of an epoxy-amine system: effect of curing agent on the glass-transition temperature, POLYM TEST, 20(8), 2001, pp. 837-845
Authors:
Boey, FYC
Chia, NK
Rath, SK
Abadie, MJM
Citation: Fyc. Boey et al., Low-energy electron beam-induced cationic polymerization with onium salts, J APPL POLY, 82(12), 2001, pp. 3099-3108
Authors:
Tok, AIY
Boey, FYC
Lam, YC
Citation: Aiy. Tok et al., Non-Newtonian fluid flow model for ceramic tape casting, MAT SCI E A, 280(2), 2000, pp. 282-288
Authors:
Boey, FYC
Song, XL
Yue, CY
Zhao, Q
Citation: Fyc. Boey et al., Modeling the curing kinetics for a modified bismaleimide resin, J POL SC PC, 38(5), 2000, pp. 907-913
Authors:
Boey, FYC
Rath, SK
Citation: Fyc. Boey et Sk. Rath, Microwave radiation curing of polymers: Using a temperature equivalent method for cure reaction analysis, ADV POLY T, 19(3), 2000, pp. 194-202
Authors:
Boey, FYC
Qiang, W
Citation: Fyc. Boey et W. Qiang, Experimental modeling of the cure kinetics of an epoxy-hexaanhydro-4-methylphthalicanhydride (MHHPA) system, POLYMER, 41(6), 2000, pp. 2081-2094
Authors:
Boey, FYC
Qiang, W
Citation: Fyc. Boey et W. Qiang, Class-transition temperature-conversion relationship for an epoxy-hexahydro-4-methylphthalic anhydride system, J APPL POLY, 78(3), 2000, pp. 511-516
Authors:
Boey, FYC
Qiang, W
Citation: Fyc. Boey et W. Qiang, Determining the gel point of an epoxy-hexaanhydro-4-methylphthalic anhydride (MHHPA) system, J APPL POLY, 76(8), 2000, pp. 1248-1256
Authors:
Tok, AIY
Boey, FYC
Khor, MKA
Citation: Aiy. Tok et al., Tape casting of high dielectric ceramic substrates for microelectronics packaging, J MAT ENG P, 8(4), 1999, pp. 469-472
Authors:
Boey, FYC
Sun, L
Song, X
Khor, KA
Citation: Fyc. Boey et al., High dielectric AlN/Al2O3 composite powder using a plasma spray approach for microelectronics application, J MAT S-M E, 10(5-6), 1999, pp. 455-459
Authors:
Boey, FYC
Song, XL
Yue, CY
Zhao, Q
Citation: Fyc. Boey et al., Effect of AlN fillers on the properties of a modified bismaleimide resin, J MATER PR, 90, 1999, pp. 437-439
Authors:
Boey, FYC
Song, XL
Gu, ZY
Tok, A
Citation: Fyc. Boey et al., AlON phase formation in a tape-cast Al2O3/AlN composite, J MATER PR, 90, 1999, pp. 478-480
Authors:
Tok, AIY
Boey, FYC
Khor, KA
Citation: Aiy. Tok et al., Tape casting of high dielectric ceramic composite substrates for microelectronics application, J MATER PR, 90, 1999, pp. 508-512
Authors:
Boey, FYC
Yap, BH
Chia, L
Citation: Fyc. Boey et al., Microwave curing of epoxy-amine system - effect of curing agent on the rate enhancement, POLYM TEST, 18(2), 1999, pp. 93-109
Risultati:
1-15
|