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101-125
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126-144
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Results: 126-144/144
Tool suite is strong medicine for SoC design headaches
Authors:
Bursky, D
Citation:
D. Bursky, Tool suite is strong medicine for SoC design headaches, ELECTR DES, 47(18), 1999, pp. 37
Enhanced flip-chip packaging technique boosts IC reliability and performance
Authors:
Bursky, D
Citation:
D. Bursky, Enhanced flip-chip packaging technique boosts IC reliability and performance, ELECTR DES, 47(17), 1999, pp. 29-30
Non-contact measurement scheme checks layer resistance and thickness on wafers
Authors:
Bursky, D
Citation:
D. Bursky, Non-contact measurement scheme checks layer resistance and thickness on wafers, ELECTR DES, 47(17), 1999, pp. 30-30
Two-chip modem delivers low-cost remote access
Authors:
Bursky, D
Citation:
D. Bursky, Two-chip modem delivers low-cost remote access, ELECTR DES, 47(16), 1999, pp. 39
Feature-rich flash memories deliver high density
Authors:
Bursky, D
Citation:
D. Bursky, Feature-rich flash memories deliver high density, ELECTR DES, 47(16), 1999, pp. 67
Next-generation OS will deliver better real-time response, multimedia capability
Authors:
Bursky, D
Citation:
D. Bursky, Next-generation OS will deliver better real-time response, multimedia capability, ELECTR DES, 47(15), 1999, pp. 36
Ring-based layer-3 switch drops port costs and improves efficiency
Authors:
Bursky, D
Citation:
D. Bursky, Ring-based layer-3 switch drops port costs and improves efficiency, ELECTR DES, 47(15), 1999, pp. 41
Today's ICs demand advanced testing
Authors:
Bursky, D
Citation:
D. Bursky, Today's ICs demand advanced testing, ELECTR DES, 47(14), 1999, pp. 22-22
Embedded logic and memory find a home in FPGAs
Authors:
Bursky, D
Citation:
D. Bursky, Embedded logic and memory find a home in FPGAs, ELECTR DES, 47(14), 1999, pp. 43
Multiprocessor DSP architecture races to deliver 1.6 billion multiply-accumulates/s
Authors:
Bursky, D
Citation:
D. Bursky, Multiprocessor DSP architecture races to deliver 1.6 billion multiply-accumulates/s, ELECTR DES, 47(13), 1999, pp. 29
Speedy flash-based FPGAs score with 500-kgate density
Authors:
Bursky, D
Citation:
D. Bursky, Speedy flash-based FPGAs score with 500-kgate density, ELECTR DES, 47(13), 1999, pp. 35
Here a DSP, there a DSP ...
Authors:
Bursky, D
Citation:
D. Bursky, Here a DSP, there a DSP ..., ELECTR DES, 47(12), 1999, pp. 18-18
Physical modeling techniques improve sound effects for games and animation
Authors:
Bursky, D
Citation:
D. Bursky, Physical modeling techniques improve sound effects for games and animation, ELECTR DES, 47(12), 1999, pp. 32
Competing DRAM architectures push performance and density limits
Authors:
Bursky, D
Citation:
D. Bursky, Competing DRAM architectures push performance and density limits, ELECTR DES, 47(11), 1999, pp. 61
Biometric sensor leverages E-fields to improve fingerprint capture
Authors:
Bursky, D
Citation:
D. Bursky, Biometric sensor leverages E-fields to improve fingerprint capture, ELECTR DES, 47(10), 1999, pp. 34
High-density PLD family combines best of FPGAs and CPLDs
Authors:
Bursky, D
Citation:
D. Bursky, High-density PLD family combines best of FPGAs and CPLDs, ELECTR DES, 47(10), 1999, pp. 38
A tale of great expectations, snake oil, and system chips
Authors:
Bursky, D
Citation:
D. Bursky, A tale of great expectations, snake oil, and system chips, ELECTR DES, 47(1), 1999, pp. 79
Advanced television, multimedia are keys to revitalization
Authors:
Bursky, D
Citation:
D. Bursky, Advanced television, multimedia are keys to revitalization, ELECTR DES, 47(1), 1999, pp. 112-113
Hit up IEDM for gigabit and denser DRAMs and merged logic/memory
Authors:
Bursky, D
Citation:
D. Bursky, Hit up IEDM for gigabit and denser DRAMs and merged logic/memory, ELECTR DES, 46(27), 1998, pp. 38
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