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Results: << | 101-125 | 126-144 |
Results: 126-144/144

Authors: Bursky, D
Citation: D. Bursky, Tool suite is strong medicine for SoC design headaches, ELECTR DES, 47(18), 1999, pp. 37

Authors: Bursky, D
Citation: D. Bursky, Enhanced flip-chip packaging technique boosts IC reliability and performance, ELECTR DES, 47(17), 1999, pp. 29-30

Authors: Bursky, D
Citation: D. Bursky, Non-contact measurement scheme checks layer resistance and thickness on wafers, ELECTR DES, 47(17), 1999, pp. 30-30

Authors: Bursky, D
Citation: D. Bursky, Two-chip modem delivers low-cost remote access, ELECTR DES, 47(16), 1999, pp. 39

Authors: Bursky, D
Citation: D. Bursky, Feature-rich flash memories deliver high density, ELECTR DES, 47(16), 1999, pp. 67

Authors: Bursky, D
Citation: D. Bursky, Next-generation OS will deliver better real-time response, multimedia capability, ELECTR DES, 47(15), 1999, pp. 36

Authors: Bursky, D
Citation: D. Bursky, Ring-based layer-3 switch drops port costs and improves efficiency, ELECTR DES, 47(15), 1999, pp. 41

Authors: Bursky, D
Citation: D. Bursky, Today's ICs demand advanced testing, ELECTR DES, 47(14), 1999, pp. 22-22

Authors: Bursky, D
Citation: D. Bursky, Embedded logic and memory find a home in FPGAs, ELECTR DES, 47(14), 1999, pp. 43

Authors: Bursky, D
Citation: D. Bursky, Multiprocessor DSP architecture races to deliver 1.6 billion multiply-accumulates/s, ELECTR DES, 47(13), 1999, pp. 29

Authors: Bursky, D
Citation: D. Bursky, Speedy flash-based FPGAs score with 500-kgate density, ELECTR DES, 47(13), 1999, pp. 35

Authors: Bursky, D
Citation: D. Bursky, Here a DSP, there a DSP ..., ELECTR DES, 47(12), 1999, pp. 18-18

Authors: Bursky, D
Citation: D. Bursky, Physical modeling techniques improve sound effects for games and animation, ELECTR DES, 47(12), 1999, pp. 32

Authors: Bursky, D
Citation: D. Bursky, Competing DRAM architectures push performance and density limits, ELECTR DES, 47(11), 1999, pp. 61

Authors: Bursky, D
Citation: D. Bursky, Biometric sensor leverages E-fields to improve fingerprint capture, ELECTR DES, 47(10), 1999, pp. 34

Authors: Bursky, D
Citation: D. Bursky, High-density PLD family combines best of FPGAs and CPLDs, ELECTR DES, 47(10), 1999, pp. 38

Authors: Bursky, D
Citation: D. Bursky, A tale of great expectations, snake oil, and system chips, ELECTR DES, 47(1), 1999, pp. 79

Authors: Bursky, D
Citation: D. Bursky, Advanced television, multimedia are keys to revitalization, ELECTR DES, 47(1), 1999, pp. 112-113

Authors: Bursky, D
Citation: D. Bursky, Hit up IEDM for gigabit and denser DRAMs and merged logic/memory, ELECTR DES, 46(27), 1998, pp. 38
Risultati: << | 101-125 | 126-144 |