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NAM HG
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CHO TJ
CHANG JY
CHA YJ
NAM SH
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Authors:
HAN MJ
PARK SJ
CHO TJ
CHANG JY
SOHN YS
LEE CO
CHOI SU
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Citation: Ty. Chung et al., THE EFFECTS OF DESCALING TREATMENTS ON INTERMETALLIC FORMATION AND THERMOMECHANICAL STABILITY OF AN ELECTROPLATED TIN LEAD LAYER IN A SEMICONDUCTOR LEADFRAME ALLOY/, Journal of materials science letters, 13(20), 1994, pp. 1465-1468