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Results:
1-4
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Results: 4
Bump bonding of pixel systems
Authors:
Lozano, M Cabruja, E Collado, A Santander, J Ullan, M
Citation:
M. Lozano et al., Bump bonding of pixel systems, NUCL INST A, 473(1-2), 2001, pp. 95-101
Reliability evaluation of a silicon-on-silicon MCM-D package
Authors:
Barton, J McCarthy, G Doyle, R Delaney, K Cabruja, E Lozano, M Collado, A Santander, J
Citation:
J. Barton et al., Reliability evaluation of a silicon-on-silicon MCM-D package, MICROEL REL, 41(6), 2001, pp. 887-899
Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layers
Authors:
Santander, J Lozano, M Collado, A Ullan, M Cabruja, E
Citation:
J. Santander et al., Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layers, IEEE DEVICE, 47(7), 2000, pp. 1431-1439
Test structures for MCM-D technology characterization
Authors:
Lozano, M Santander, J Cabruja, E Perello, C Ullan, M Lora-Tamayo, E Doyle, R McCarthy, G Barton, J
Citation:
M. Lozano et al., Test structures for MCM-D technology characterization, IEEE SEMIC, 12(2), 1999, pp. 184-192
Risultati:
1-4
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